Circuit board processing method

Abstract

The invention discloses a circuit board processing method, and the method comprises the following steps: placing a circuit board to be processed on a processing platform, then arranging a cover plate on the circuit board, carrying out first-step feed processing on the circuit board along a preset milling cutter processing path, and then carrying out second-step feed processing on the circuit board; and repeatedly executing the processing step of the second feeding processing to complete the processing of the preset milling cutter processing path of the circuit board at one time. A preset groove is milled in the circuit board at a time, and the problem that the cost is high and the efficiency is low due to the fact that the circuit board is milled twice in an existing machining method is solved.

Description

technical field [0001] The present invention relates to the field of circuit boards, and more specifically, relates to a method for processing circuit boards. Background technique [0002] At present, circuit boards are used more and more widely, and the design requirements are more and more complex. Among them, when the customer designs the inner layer line, some specific layers must be connected with the designed strata. The common way is that the outer layer is electroplated after milling slots (passing through the layers that need to be grounded). In order to ensure good grounding performance, the depth accuracy of blind grooves with controlled depth milling is highly required. The common depth tolerance is ±0.05mm. Blind groove milling accuracy capability, the common design is to mill two times with 0.2mm as the reserved space. Although this method can guarantee the depth tolerance of the customer's design, it increases the processing time and processing cost for the ...

AI Technical Summary

Problems solved by technology

In order to ensure good grounding performance, the depth accuracy of blind slots with controlled depth milling is highly required. The common depth tolerance is ±0.05mm. Blind groove milling accuracy capability, the common design is to mill two times with 0.2mm as the reserved space. Although this method can guarantee the depth tolerance of the customer's design, it increases the processing time and cost for the processing manufacturer, and Reduced equipment utilization

[0003] Therefore, the current technical problem is that the existing processing method circuit board is milled twice, which is high in cost and low in efficiency.

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