Circuit board processing method

Abstract

The invention discloses a circuit board processing method. The circuit board to be processed is placed on a processing platform, and then a cover plate is set on the circuit board, and the circuit board is first walked along a predetermined milling cutter processing path. Then, perform the second pass of the circuit board whose processing width is smaller than that of the first pass, and repeat the processing steps of the second pass to complete the processing of the predetermined milling cutter processing path of the circuit board at one time. . The predetermined groove is milled on the circuit board at one time, which solves the problem of high cost and low efficiency that the circuit board is milled twice in the existing processing method.

Description

technical field [0001] The present invention relates to the field of circuit boards, more particularly, to a method for processing circuit boards. Background technique [0002] At present, the application of circuit boards is becoming more and more extensive, and the design requirements are becoming more and more complex. Among them, when the customer designs the inner layer line, some specific layers must be connected with the designed stratum. A common way is to plated the outer layer after milling (through the layer that needs to be grounded). In order to ensure good grounding performance, the depth accuracy of the blind slot for depth-controlling milling is very high. The common depth tolerance is: ±0.05mm, but it is affected by the uniformity of the machining tool plate or backing plate during the milling process. The accuracy of blind slot milling is usually designed to be processed twice with a reserved space of 0.2mm. Although this method can ensure the depth toler...

AI Technical Summary

Problems solved by technology

In order to ensure good grounding performance, the depth accuracy of blind slots with controlled depth milling is highly required. The common depth tolerance is ±0.05mm. Blind groove milling accuracy capability, the common design is to mill two times with 0.2mm as the reserved space. Although this method can guarantee the depth tolerance of the customer's design, it increases the processing time and cost for the processing manufacturer, and Reduced equipment utilization

[0003] Therefore, the current technical problem is that the existing processing method circuit board is milled twice, which is high in cost and low in efficiency.

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