Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Preparation method of FPC board

A core board and substrate technology, applied in the field of FPC board preparation, can solve the problems of product electrical performance risk, consistency mismatch, increase product thickness, etc.

Inactive Publication Date: 2021-05-07
AKM ELECTRONICS INDAL PANYU
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the adhesive glue is used to press the layers, the thickness of the product is increased, and there is a mismatch in the consistency of Dk and Df, which poses a certain risk to the electrical performance of the product.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of FPC board
  • Preparation method of FPC board
  • Preparation method of FPC board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The technical solution of the present invention will be further described in detail below in conjunction with specific examples, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

[0026] refer to Figure 1-4 , an embodiment of the present invention provides a method for preparing an FPC board. The first core board 10 and the second core board 20 are pressed together. The first core board 10 includes a first copper layer 12 and a first dielectric layer 11 arranged in sequence. , the second core board 20 includes a second copper layer 23, a second dielectric layer 22 and an inner circuit layer 21 arranged in sequence. After lamination, the inner circuit layer 21 is located between the first dielectric layer 11 and the second dielectric layer. Between the layers 22, the FPC board obtained after lamination includes the first copper layer 12, the first dielec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides a preparation method of an FPC board, a first core board and a second core board are laminated, the first core board comprises a first copper layer and a first dielectric layer which are arranged in sequence, the second core board comprises a second copper layer, a second dielectric layer and an inner circuit layer which are arranged in sequence, after lamination, the inner circuit layer is located between the first dielectric layer and the second dielectric layer, the first dielectric layer and the second dielectric layer are connected, and the first dielectric layer and / or the second dielectric layer fill a gap of the inner circuit layer. The FPC board prepared by the preparation method of the FPC board provided by the invention is relatively small in thickness.

Description

technical field [0001] The invention belongs to the field of FPC board preparation, and in particular relates to a preparation method of an FPC board. Background technique [0002] With the rapid development of information technology, considering the acceleration of global 5G and other high-speed transmission technologies for a period of time in the future, in order to meet the high-frequency and high-speed signal transmission and reduce the production cost of terminal equipment, various forms of mixed-voltage structures appear in the market Multilayer board design and application. Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing. Due to the flexible printed circuit board (FPC, Flexible Printed Circuit) has the characteristics of flexibility and three-dimensional space wiring, etc., it emphasizes lightness, shortness and flexibility in techn...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 潘俊华潘丽郑玉川李荣
Owner AKM ELECTRONICS INDAL PANYU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com