A display substrate, manufacturing method and display device
A manufacturing method and display panel technology, which are applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of low light utilization rate and high light loss, and achieve the effects of overcoming optical crosstalk, reducing loss and improving light utilization rate.
Active Publication Date: 2022-03-11
苏州芯聚半导体有限公司
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Problems solved by technology
[0006] The problem solved by the present invention is how to solve the problem of low light utilization rate due to excessive light loss during the photoluminescence process in the existing Micro LED display device
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[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0033] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be constr...
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The present invention provides a display panel, a manufacturing method, and a display device. The display panel includes a substrate and a plurality of micro light-emitting diodes arranged on one side of the substrate; a first insulating layer, and the first insulating layer is arranged on the substrate. The side of the plurality of micro light emitting diodes away from the substrate, the first insulating layer includes a plurality of first through holes and a plurality of second through holes, each micro light emitting diode is exposed from the corresponding first through hole, Partitions between any adjacent micro light emitting diodes are exposed from corresponding second through holes; and a first reflective layer, the first reflective layer is disposed on a side of the first insulating layer away from the substrate, The first reflective layer includes a first pattern and a plurality of third through holes, each third through hole corresponds to each first through hole, so that each micro light emitting diode is exposed from the corresponding third through hole The first pattern covers the plurality of second through holes, and the first pattern covers the sidewall of the first insulating layer in the second through holes.
Description
technical field [0001] The invention belongs to the field of display technology, and in particular relates to a display substrate, a manufacturing method thereof and a display device. Background technique [0002] Light Emitting Diodes (LEDs) based on inorganic semiconductors are widely used in solid-state light sources or backlights of liquid crystal display devices due to their advantages of high luminous efficiency, low cost, long life, and environmental protection. In a liquid crystal display device, after the light emitted by the LED is deflected by the liquid crystal, most of the light will be absorbed by the color filter, and only a small amount of light will exit, resulting in a light utilization rate of only 2.8%, which means that the required The backlight needs to be more than ten times brighter. [0003] In order to improve light utilization efficiency and reduce power consumption costs, a variety of new active display technologies have emerged, such as Organic ...
Claims
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IPC IPC(8): H01L33/46H01L33/64H01L27/15
CPCH01L33/46H01L33/642H01L27/156H01L2933/0025H01L2933/0075
Inventor 韦冬李庆于波黄朝葵
Owner 苏州芯聚半导体有限公司