Cooling systems for immersion cooled it equipment
A cooling system and equipment technology, applied in electrical equipment structural parts, cooling/ventilation/heating renovation, electrical components, etc., can solve the problems of lack of end-to-end complete system solutions and service interruption in the data center cooling market
Pending Publication Date: 2021-05-14
BAIDU USA LLC
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
To prevent overheating when maintenance is performed, the electronics inside the box must be turned off, causing service interruption
[0005] Existing data center cooling market lacks end-to-end complete system solutions to address immersion cooling design and deployment challenges
Method used
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[0033] Aspects of the present disclosure are now explained with reference to the figures. As long as the shapes, relative positions, and other aspects of the components described in a given aspect are not explicitly limited, the scope of the disclosure herein is not limited only to the components shown, which are for illustrative purposes only. Furthermore, while numerous details are set forth, it is understood that some aspects may be practiced without these details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description. Further, all ranges stated herein are considered to include the endpoints of each range unless it is clearly indicated to the contrary.
[0034] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embo...
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The invention relates to an IT equipment cooling system, a data center cooling system and an IT cooling system module. According to one embodiment, an information technology (IT) equipment cooling system includes an IT cooling module having one or more pieces of IT equipment that is configured to provide IT services and is at least partially submerged within a liquid coolant. While the equipment provides the services, heat is generated and transferred into the coolant thereby causing at least some of the coolant to turn into a vapor. The system also includes a condenser that is positioned above the module and is configured to condense the vapor back into liquid coolant. The system includes return and supply lines that are both coupled to the condenser and to the module to create a heat exchanging loop. The return and supply line is configured to provide vapor to the condenser, and the supply line is configured to provide condensed liquid coolant to the IT cooling module. The system includes an accumulator that is disposed on the supply line and is configured to accumulate the condensed liquid coolant before the coolant is provided to the module.
Description
technical field [0001] Embodiments of the present disclosure generally relate to cooling systems for immersion cooling of information technology (IT) equipment. In particular, the present invention relates to an information technology (IT) equipment cooling system, a data center cooling system and an information technology (IT) cooling system module. Background technique [0002] For data centers that include multiple active electronics racks, thermal management is critical to ensuring proper performance of servers and other IT equipment operating in the racks (eg, performing IT services). However, without proper thermal management, the thermal environment (e.g. temperature) inside the rack may exceed the thermal operating threshold, which may lead to undesirable consequences (e.g. server failure, etc.). One way to manage the thermal environment is to use cooling air to cool IT equipment. The cooling air is recirculated through the cooling unit. The heat generated by the ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20
CPCH05K7/208H05K7/203H05K7/20818H05K7/20836H05K7/20318H05K7/2079H05K7/20327H05K7/20745H05K7/20827
Inventor 高天翼
Owner BAIDU USA LLC