Computer heat dissipation device

Abstract

The invention discloses a computer heat dissipation device, and relates to the technical field of computer heat dissipation; the computer heat dissipation device comprises a heat dissipation substrate, a plurality of heat dissipation insertion fins, a dust scraping part and a reinforced heat dissipation assembly; the heat dissipation substrate is installed on a to-be-cooled element in a computer, and the plurality of heat dissipation insertion fins are uniformly distributed on the side end face of the heat dissipation substrate. The reinforced heat dissipation assembly is arranged on the heat dissipation substrate, and the dust scraping parts are arranged on the heat dissipation insertion fins, so that heat can be dissipated more quickly from a larger heat dissipation surface formed by combining the heat dissipation insertion fins and the extension plates; reciprocating expansion and contraction of the expansion and contraction air bag are achieved through real-time rising and falling of the temperature of hardware in the computer, the dust scraping head is driven to scrape dust attached to the heat dissipation insertion fins, and the scraped dust is discharged out of the computer along a channel formed by the connecting rod, the ventilation pipe, the dust discharging pipe and the mounting cover, so that the purpose of controlling automatic dust removal of the hardware in the computer according to the temperature change is achieved.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a computer heat dissipation device. Background technique [0002] At present, the heat dissipation methods of computers usually include air cooling and water cooling. Air cooling heat dissipation is to spread the heat generated by internal components through the heat dissipation fins, and then discharge it to the outside of the computer through the circulating air flow. The principles of water cooling and air cooling are similar. , Just replace the cooling fin with a cold row, and the heat generated by the internal components is directly extracted by the cold row. [0003] However, in the course of long-term use, it is found that the existing heat dissipation device still has certain disadvantages: 1. The air-cooled heat dissipation method is relatively noisy, and because the heat dissipation fan on the internal components blows inward, the heat dissipation fan ...

AI Technical Summary

Problems solved by technology

[0003] However, in the course of long-term use, it is found that the existing heat dissipation device still has certain disadvantages: 1. The air-cooled heat dissipation method is relatively noisy, and because the heat dissipation fan on the internal components blows inward, the heat dissipation fan of the chassis Blowing outwards, the wind force in the middle of the air circulation path is weak, and it is very easy to accumulate dust inside, which will seriously affect the heat dissipation after a long time. At the same time, because the heat dissipation area of ​​the heat dissipation fins is fixed, and the speed of the heat dissipation fan is constant, the heat dissipation capacity cannot be determined according to the actual situation. 2. Although the water-cooled heat dissipation method is better than the air-cooled heat dissipation method, the structure is complicated and the cost is high. At the same time, it is still unable to prevent Dust builds up on internal components

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