computer cooling device

Abstract

The invention discloses a computer heat dissipation device, which relates to the technical field of computer heat dissipation, and comprises a heat dissipation substrate, a heat dissipation insert, a dust scraping part and a reinforced heat dissipation assembly. There are several fins and they are evenly distributed on the side end surfaces of the heat dissipation substrate. In the present invention, by arranging a reinforced heat dissipation component on the heat dissipation substrate and a dust scraping part on the heat dissipation insert, the heat can be dissipated more quickly from the larger heat dissipation surface combined with the heat dissipation insert and the extension plate; The real-time lifting and lowering realizes the reciprocating expansion and contraction of the expansion and contraction air bag, and drives the scraper head to scrape off the dust attached to the cooling fins. The scraped dust is formed along the connecting rod, ventilation pipe, dust pipe and installation cover The channel is discharged to the outside of the computer to achieve the purpose of controlling the automatic dust removal of the computer's internal hardware by temperature changes.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a computer heat dissipation device. Background technique [0002] At present, the heat dissipation methods of computers usually include air cooling and water cooling. Air cooling heat dissipation is to spread the heat generated by internal components through the heat dissipation fins, and then discharge it to the outside of the computer through the circulating air flow. The principles of water cooling and air cooling are similar. , Just replace the cooling fin with a cold row, and the heat generated by the internal components is directly extracted by the cold row. [0003] However, in the course of long-term use, it is found that the existing heat dissipation device still has certain disadvantages: 1. The air-cooled heat dissipation method is relatively noisy, and because the heat dissipation fan on the internal components blows inward, the heat dissipation fan ...

AI Technical Summary

Problems solved by technology

[0003] However, in the course of long-term use, it is found that the existing heat dissipation device still has certain disadvantages: 1. The air-cooled heat dissipation method is relatively noisy, and because the heat dissipation fan on the internal components blows inward, the heat dissipation fan of the chassis Blowing outwards, the wind force in the middle of the air circulation path is weak, and it is very easy to accumulate dust inside, which will seriously affect the heat dissipation after a long time. At the same time, because the heat dissipation area of ​​the heat dissipation fins is fixed, and the speed of the heat dissipation fan is constant, the heat dissipation capacity cannot be determined according to the actual situation. 2. Although the water-cooled heat dissipation method is better than the air-cooled heat dissipation method, the structure is complicated and the cost is high. At the same time, it is still unable to prevent Dust builds up on internal components

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