Three-dimensional integrated structure and manufacturing method thereof

A technology of three-dimensional integration and manufacturing method, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc. Effect
CN112908993APending Publication Date: 2021-06-04FUDAN UNIV +1

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FUDAN UNIV
Publication Date
2021-06-04

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Abstract

The invention provides a three-dimensional integrated structure which comprises a silicon substrate, a first nano capacitor and a second nano capacitor, the first nano capacitor and the second nano capacitor respectively adopt a first insulating substrate and a second insulating substrate, and due to the insulation property of the first insulating substrate and the second insulating substrate, the first bottom metal electrode layer can be directly arranged on the first insulating substrate, the second bottom metal electrode layer can be directly arranged on the second insulating substrate, the manufacturing process is reduced, the second insulating substrate is provided with a plurality of first containing grooves at intervals, and the bottom ends of the first containing grooves are provided with openings for exposing the first top metal electrode layer. The second bottom metal electrode layer is electrically connected with the first top metal electrode layer through the opening, so that the second bottom metal electrode layer is connected with the first top metal electrode layer while the second bottom metal electrode layer is arranged in the first accommodating groove, and the time for preparing the integrated structure is shortened. In addition, the invention also provides a manufacturing method of the three-dimensional integrated structure.
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Description

technical field

[0001] The invention relates to the technical field of semiconductors, in particular to a three-dimensional integrated structure and a manufacturing method thereof. Background technique

[0002] At present, for portable electronic devices, batteries are still the main energy supply components. Although battery technology is constantly developing, a compromise still needs to be made between the capacity, volume and weight of the battery. Accordingly, some alternative power supply components with large capacity, light weight, and small size have been researched and developed, such as micro fuel cells, plastic solar cells, and energy harvesting systems.

[0003] In all cases mentioned above, an energy buffer system is usually required to maintain a continuous and steady energy output. For example, fuel cell systems are generally believed to have slower start-up times and lower kinetic energy. Therefore, a hybrid system in which the fuel cell provides the basic...

Claims

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