Three-dimensional integrated structure and manufacturing method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- FUDAN UNIV
- Publication Date
- 2021-06-04
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductors, in particular to a three-dimensional integrated structure and a manufacturing method thereof. Background technique
[0002] At present, for portable electronic devices, batteries are still the main energy supply components. Although battery technology is constantly developing, a compromise still needs to be made between the capacity, volume and weight of the battery. Accordingly, some alternative power supply components with large capacity, light weight, and small size have been researched and developed, such as micro fuel cells, plastic solar cells, and energy harvesting systems.
[0003] In all cases mentioned above, an energy buffer system is usually required to maintain a continuous and steady energy output. For example, fuel cell systems are generally believed to have slower start-up times and lower kinetic energy. Therefore, a hybrid system in which the fuel cell provides the basic...