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Method for improving copper wire notches in surface of circuit board

A technology for circuit boards and copper wires, which is applied to the removal of conductive materials by mechanical methods, removal of conductive materials by chemical/electrolytic methods, and printed circuits, etc. There are gaps and other problems to achieve the effect of improving the unevenness of copper thickness, improving the quality, and improving the tightness

Active Publication Date: 2021-06-08
肇庆市武大环境技术研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After copper plating, the copper thickness on the surface of the circuit board has a certain degree of inhomogeneity. In the subsequent film application, the dry film is not tightly bonded to the surface of the circuit board due to the uneven copper thickness and roughness of the copper surface, resulting in the loss of copper after etching. The quality of the line is degraded, and it is easy to have quality defects such as gaps

Method used

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  • Method for improving copper wire notches in surface of circuit board
  • Method for improving copper wire notches in surface of circuit board
  • Method for improving copper wire notches in surface of circuit board

Examples

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Embodiment 1

[0024] A method for improving copper wire gaps on the surface of circuit boards, including the steps of cutting, pressing, copper plating, grinding, chemical micro-etching, pattern transfer, etching, and film removal; wherein:

[0025] Cutting, lamination, copper plating, graphics transfer, etching, film stripping processes are produced according to the conventional process;

[0026] Among them, the COV value of the copper thickness uniformity on the surface of the circuit board after copper plating is 7.8%, and the copper thickness is extremely poor at 14 μm.

[0027] In the grinding process, the grinding conditions used are: 1 pair of 800-mesh ceramic grinding brushes, 1 pair of 320-mesh high-cutting non-woven fabric grinding brushes, 2 pairs of 600-mesh non-woven fabric grinding brushes, the grinding current is 1.0A, and the grinding plate speed is 2.0m / min, the surface of the circuit board is polished, the COV value of the surface copper thickness uniformity after grindin...

Embodiment 2

[0033] A method for improving copper wire gaps on the surface of circuit boards, including the steps of cutting, pressing, copper plating, grinding, chemical micro-etching, pattern transfer, etching, and film removal; wherein:

[0034] Cutting, lamination, copper plating, pattern transfer, etching, and defilming processes are produced according to conventional processes.

[0035] Among them, the COV value of the copper thickness uniformity on the surface of the circuit board after copper plating is 6.9%, and the copper thickness is extremely poor at 12 μm.

[0036] In the grinding process, the grinding conditions used are: 1 pair of 600-mesh ceramic grinding brushes, 1 pair of 320-mesh high-cut non-woven grinding brushes, 2 pairs of 800-mesh non-woven grinding brushes, the grinding current is 1.5A, and the grinding speed is 2.0m / min, the surface of the circuit board is polished, the COV value of the surface copper thickness uniformity after grinding the board is 4.3%, the cop...

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Abstract

The invention discloses a method for improving copper wire notches in the surface of a circuit board, which is characterized by adding a board grinding procedure between copper plating and chemical micro-etching in an existing circuit board manufacturing process. According to the method for improving the copper wire notches in the surface of the circuit board, the board grinding procedure is added, on one hand, the copper cutting amount is controlled by adjusting currents of grinding brushes according to the actual requirements of customers, in the board grinding process, the grinding brushes and the circuit board are mainly ground in an extrusion and grinding brush rolling mode, during board grinding, uneven copper parts are ground away preferentially, so that the leveling effect is achieved, the phenomenon that the copper thickness on the surface of the circuit board is not uniform after copper plating is improved, and the copper thickness is adjustable and controllable; and on the other hand, the roughness Ra value of the copper surface is 0.35-0.65 [mu] m after the plate grinding treatment, which is equivalent to the roughness value after the chemical micro-etching treatment, so that the tightness of the subsequent combination of the dry film and the surface copper foil is improved, the quality of copper wire manufacturing is greatly improved, and the qualification rate of the circuit etching copper wire is improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a method for improving copper wire gaps on the surface of circuit boards. Background technique [0002] With the development of science and technology, electronic products are gradually miniaturized, multi-functional and highly integrated. Therefore, the width of copper wires on the surface of circuit boards is required to be smaller, the wiring density is denser, and the gaps in copper wires are less. During the production process of the circuit board, copper plating is often required to increase the copper thickness of the circuit board surface. After copper plating, the copper thickness on the surface of the circuit board has a certain degree of inhomogeneity. In the subsequent film application, the dry film is not tightly bonded to the surface of the circuit board due to the uneven copper thickness and roughness of the copper surface, resulting in t...

Claims

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Application Information

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IPC IPC(8): H05K3/04H05K3/06
CPCH05K3/04H05K3/06H05K2203/025
Inventor 侯浩波叶非华张鹏举纪建业韩旭李银生
Owner 肇庆市武大环境技术研究院