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A method for improving the copper wire gap on the surface of the circuit board

A circuit board and notch technology, which is applied in the direction of removing conductive materials by mechanical methods, removing conductive materials by chemical/electrolytic methods, printing circuits, etc., can solve the problems of uneven roughness of copper surface, degradation of copper wire quality, and easy existence Gap and other problems, to achieve the effect of improving uneven copper thickness, improving quality, and improving pass rate

Active Publication Date: 2022-07-29
肇庆市武大环境技术研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After copper plating, the copper thickness on the surface of the circuit board has a certain degree of inhomogeneity. In the subsequent film application, the dry film is not tightly bonded to the surface of the circuit board due to the uneven copper thickness and roughness of the copper surface, resulting in the loss of copper after etching. The quality of the line is degraded, and it is easy to have quality defects such as gaps

Method used

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  • A method for improving the copper wire gap on the surface of the circuit board
  • A method for improving the copper wire gap on the surface of the circuit board
  • A method for improving the copper wire gap on the surface of the circuit board

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Embodiment 1

[0024] A method for improving the gap of copper wires on the surface of a circuit board, comprising the steps of cutting, pressing, copper plating, grinding, chemical micro-etching, pattern transfer, etching, and film stripping; wherein:

[0025] The processes of cutting, pressing, copper plating, pattern transfer, etching, and film stripping are made according to conventional processes;

[0026] Among them, the COV value of the copper thickness uniformity on the surface of the circuit board after copper plating is 7.8%, and the copper thickness range is 14 μm.

[0027] In the grinding process, the grinding conditions used are: 1 pair of 800-mesh ceramic grinding brushes, 1 pair of 320-mesh high-cutting non-woven grinding brushes, 2 pairs of 600-mesh non-woven grinding brushes, grinding current of 1.0A, grinding speed of 2.0m / min, grind the surface of the circuit board, the copper thickness uniformity COV value of the surface after grinding the board is 4.5%, the copper thick...

Embodiment 2

[0033] A method for improving the gap of copper wires on the surface of a circuit board, comprising the steps of cutting, pressing, copper plating, grinding, chemical micro-etching, pattern transfer, etching, and film stripping; wherein:

[0034] The processes of cutting, pressing, copper plating, pattern transfer, etching, and film stripping are made according to conventional processes.

[0035] Among them, the COV value of the copper thickness uniformity on the surface of the circuit board after copper plating is 6.9%, and the copper thickness range is 12 μm.

[0036] In the grinding process, the grinding conditions used are: 1 pair of 600-mesh ceramic grinding brushes, 1 pair of 320-mesh high-cutting non-woven grinding brushes, 2 pairs of 800-mesh non-woven grinding brushes, grinding current of 1.5A, grinding speed of 2.0m / min, grind the surface of the circuit board, the copper thickness uniformity COV value of the surface after grinding the board is 4.3%, the copper thick...

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Abstract

The invention discloses a method for improving the copper wire notch on the surface of a circuit board, which is to add a plate grinding process between copper plating and chemical micro-etching of the existing circuit board. The invention provides a method for improving the copper wire gap on the surface of the circuit board. By adding a grinding process, on the one hand, according to the actual needs of the customer, the amount of copper cutting is controlled by adjusting the current of each grinding brush. In addition, during the grinding process, the grinding brush and The circuit boards are mainly polished by extrusion and brushing and rolling. When grinding the boards, the uneven copper part is preferentially polished, so as to play a leveling role, improve the uneven copper thickness on the surface of the circuit board after copper plating, and realize the The copper thickness is adjustable and controllable; on the other hand, after grinding, the surface roughness Ra value of copper is between 0.35-0.65μm, which is equivalent to the roughness value after chemical micro-etching treatment, thereby improving the subsequent dry film and surface The tightness of copper foil bonding greatly improves the quality of copper wire production and improves the pass rate of copper wire etching.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a method for improving the copper wire gap on the surface of the circuit board. Background technique [0002] With the development of science and technology, electronic products are gradually miniaturized, multi-functional and highly integrated. Therefore, the copper wire width on the surface of the circuit board is required to be smaller, the wiring density is denser, and the copper wire gap is less. In the production process of the circuit board, it is often necessary to thicken the copper thickness of the circuit board surface by copper plating. There is a certain degree of non-uniformity in the copper thickness on the surface of the circuit board after copper plating. In the subsequent filming, it is easy to cause the dry film and the circuit board surface to be not tightly combined due to the uneven copper thickness and copper surface roughness on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/04H05K3/06
CPCH05K3/04H05K3/06H05K2203/025
Inventor 侯浩波叶非华张鹏举纪建业韩旭李银生
Owner 肇庆市武大环境技术研究院