Opening and drawing device of circuit board stamping die
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 佛山市顺德区兆达电子有限公司
- Publication Date
- 2021-07-13
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the field of extracting devices, in particular to an extracting device for a stamping die of a circuit board. Background technique
[0002] Printed circuit board stamping die is a professional precision mold developed with the development of the electronics industry. With the demand for improving production efficiency in downstream factories and technological progress, printed circuit boards have been changed from single-piece production to jigsaw production. The stamping die of this printed circuit board also becomes larger, making the die relatively heavy. When assembling, correcting and maintaining circuit board stamping dies, it is inseparable to open the upper die and lower die. To maintain the precision of the mold, it depends on the precision guide post and guide sleeve assembly of the mold device and its maintenance. The gap between the guide post and the guide sleeve is extremely small, and there is lubricating oil b...