Check patentability & draft patents in minutes with Patsnap Eureka AI!

Cup body cleaning method

A cup and cleaning technology, applied in the direction of liquid cleaning method, cleaning method and utensils, chemical instruments and methods, etc., can solve the problems of reducing the yield rate of semiconductor devices

Inactive Publication Date: 2021-07-16
TAIWAN SEMICON MFG CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During semiconductor fabrication, particles and / or contaminants may undesirably obscure portions of a wafer reducing the yield of fabricated semiconductor devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cup body cleaning method
  • Cup body cleaning method
  • Cup body cleaning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0084] It should be appreciated that the following disclosure provides many different embodiments, or examples, for implementing different features of embodiments of the disclosure. Specific examples of components and configurations are described below to simplify the description of the embodiments of the disclosure. Of course, these specific examples are only for illustration and are not intended to limit the embodiments of the present disclosure. For example, in the following descriptions, it is mentioned that the first feature is formed on or above the second feature, which means that it may include the embodiment that the first feature is in direct contact with the second feature, and may also include an embodiment in which additional features are formed on or above the second feature. Between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact with each other. In addition, various features may be arbitra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An apparatus includes a wafer stage and a particle removal assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removal assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removal assembly may be a flexible discharge member that includes one or more elongate tubes, a leading tip, and a cleaning tip adapter. The cleaning tip adapter is configured to attach the leading tip to each of the one or more elongate tubes. The front tip includes a front opening and a side opening from which the pressurized cleaning material is discharged. The pressurized cleaning material is directed onto an inaccessible area of the cup body to remove contaminant particles from the cup body. The invention further relates to a cleaning method of the cup body.

Description

technical field [0001] Embodiments of the present disclosure relate to a cleaning method for a cup body, in particular to a cleaning method for removing pollutant materials from a cup body by using a particle removal assembly. Background technique [0002] During semiconductor fabrication, particles and / or contaminants may undesirably obscure portions of a wafer reducing the yield of fabricated semiconductor devices. Therefore, it is desirable to maintain a clean environment where wafers pass through during the manufacturing process. Contents of the invention [0003] Embodiments of the present disclosure provide a method of cleaning a cup used in a wet processing tool, comprising: providing a cup in a chamber adjacent to a wafer chuck, the cup configured to prevent diffusion of contaminants into the chamber. The particle removal assembly is configured to remove contaminants from inaccessible areas of the linear fluid pathway caused by the curvature of the cup. The parti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/08B08B13/00
CPCB08B3/02B08B3/08B08B13/00B08B9/0813H01L21/67051H01L21/67028
Inventor 吴孟学郭芳妤刘铠毓吴彧群黄招胜陈威毅
Owner TAIWAN SEMICON MFG CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com