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Integrated circuit

An integrated circuit, integrated technology, applied in the direction of circuits, electrical components, electrical solid devices, etc.

Inactive Publication Date: 2021-07-16
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The miniaturization process also leads to stricter design and manufacturing specifications, and reliability challenges

Method used

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  • Integrated circuit
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Embodiment Construction

[0080] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the description below, forming a first feature over or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments in which the first and second features are formed Embodiments where additional features are formed such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat element symbols and / or letters in various examples. This repetition is for brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0081] In addition, f...

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Abstract

Disclosed herein are related to an integrated circuit having a dual power structure with an efficient layout and a method of forming the integrated circuit. In one aspect, the integrated circuit includes a substrate, a first layer facing the substrate, and a second layer facing the first layer. In one aspect, the first layer includes a set of first metal rails, where each of the set of first metal rails may be separated from its adjacent one of the set of first metal rails according to a uniform pitch along a direction. In one aspect, the second layer includes a set of second metal rails, where the set of second metal rails may include two adjacent second metal rails separated according to a first pitch along the direction and additional two adjacent second metal rails separated according to a second pitch along the direction.

Description

technical field [0001] This case relates to an integrated circuit, and in particular to an integrated circuit having a dual power structure with an efficient layout. Background technique [0002] Recent trends in miniaturizing integrated circuits (ICs) have resulted in smaller components that consume less power and still provide more functionality at higher speeds. The miniaturization process also leads to stricter design and manufacturing specifications, and reliability challenges. Various electronic design automation (EDA) tools generate, optimize, and verify standard cell layout patterns for integrated circuits while ensuring that standard cell layout design and manufacturing specifications are met. Contents of the invention [0003] One aspect of this description is with respect to an integrated circuit. In some embodiments, an integrated circuit includes a substrate, a first layer facing the substrate, and a second layer facing the first layer. The second layer may...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/50H01L23/528
CPCH01L23/50H01L23/528H01L23/5286H01L27/0207H01L27/092H01L27/11807H01L2027/11875G06F30/392H01L2027/11861H01L2027/11881H01L2027/11887
Inventor 彭士玮曾健庭
Owner TAIWAN SEMICON MFG CO LTD