Piezoelectric vibration device

Abstract

This piezoelectric vibration device is provided with an inner space in which a vibrating section (11) of a crystal diaphragm (10) that includes a first excitation electrode (111) and a second excitation electrode (112) is hermetically sealed by joining a first sealing member (20) to the crystal diaphragm (10) and by joining a second sealing member (30) to the crystal diaphragm (10). A through-hole (33) is formed in the second sealing member (30), and formed on the inner wall face of the through-hole (33) is a through-electrode (331) for electrically connecting an electrode (34) formed on a first main face (301) to an external electrode terminal (32) formed on a second main face (302). The through-electrode (331) is provided with a structure which is corrosion-resistant to solder (120), and the through-electrode (331) electrically connects the electrode (34) of the first main face (301) to the external electrode terminal (32) of the second main face (302) by means of an electrically conductive metal other than silver (Au).

Description

technical field [0001] The present invention relates to piezoelectric vibration devices. Background technique [0002] In recent years, various electronic devices are developing towards higher operating frequencies and miniaturization (especially lower profile) of packages. Therefore, with the increase in frequency and the miniaturization of packages, piezoelectric vibration devices (such as crystal resonators, crystal oscillators, etc.) are required to be able to cope with the increase in frequency and the miniaturization of packages. [0003] The housing of such a piezoelectric vibration device is generally composed of an approximately rectangular parallelepiped package. The package includes, for example, a first sealing member and a second sealing member made of glass or quartz crystal, and a piezoelectric vibrating plate made of, for example, quartz crystal and having excitation electrodes formed on both main surfaces. The second sealing members are laminated and bonde...

AI Technical Summary

Problems solved by technology

[0005] However, since Sn (tin) is contained in the solder, when the through-hole electrode has an Au film made of Au (gold), the solder may wet and spread along the Au film. extended) into the penetrating electrode

Therefore, the Au constituting the Au film will aggregate under the erosive action of the solder, which may cause problems such as an increase in on-resistance and disconnection.

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