Control method, equipment and storage medium for chemical mechanical polishing

Abstract

The present application discloses a chemical mechanical grinding control method, equipment and storage medium. The method includes: calculating a first grinding time according to a first pre-value, a first post-value and a first grinding rate; according to the first grinding time , control the first type of grinding disc to grind the target wafer; according to the second pre-value, the second post-value and the second grinding rate, calculate the second grinding time, the second type of grinding disc and the first type The hardness of the grinding disc is different; according to the second grinding time, the grinding disc of the second type is controlled to grind the target wafer. The present application obtains the first grinding time of the first type of grinding disc and the second grinding time of the second type of grinding disc, so as to grind the target wafer according to the first grinding time and the second grinding time. The time and the second time are calculated based on the thickness difference in the last grinding process, so that the grinding thickness can be accurately controlled and the yield of the product is improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a control method, equipment and storage medium for chemical mechanical polishing (CMP). Background technique [0002] The chemical mechanical polishing process is an important process in the manufacture of semiconductor devices. It uses the synergy of chemical etching and mechanical polishing to planarize the semiconductor wafer, which can effectively take into account the local and global flatness of the semiconductor device. [0003] In the related art, in the chemical grinding process, it includes a grinding step by time and a grinding step by dynamic time. The grinding step with a fixed time is a method of grinding with a fixed time, and the grinding step with a dynamic time is a method of grinding by dynamically adjusting the grinding time. [0004] However, in the polishing step of a fixed time (especially in the process of chemical mecha...

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Problems solved by technology

[0005] The present application provides a chemical mechanical grinding control method, equipment and storage medium, which can solve the problem of product reliability and good performance caused by the fluctuation of the grinding rate of the grinding disc in the grinding step of a fixed time in the chemical mechanical grinding method provided in the related art. low rate problem

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