Sealed packaging method for copper target material

A technology of sealing packaging and copper targets, which is applied in the field of semiconductors, can solve the problems of complex structure of packaging parts and unfavorable industrial application, and achieve the effect that the sealing packaging method is simple and easy to implement, and is convenient for industrial promotion and application

Pending Publication Date: 2021-08-27
合肥江丰电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the complex structure of the package is not conducive to industrial application

Method used

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  • Sealed packaging method for copper target material
  • Sealed packaging method for copper target material
  • Sealed packaging method for copper target material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] This embodiment provides a method for sealing and packaging a copper target, and the method for sealing and packaging includes the following steps:

[0065] Place the copper target in a sealed bag;

[0066] A first sealing member and a second sealing member are sequentially sleeved outside the sealed bag; the first sealing member and the second sealing member are respectively independently plastic films with a thickness of 150 μm; the tensile strength of the plastic film is 60N / 15mm ;

[0067] Argon is filled in the sealed bag, between the sealed bag and the first sealing member, and in the cavity surrounded by two adjacent layers of sealing members; a desiccant calcium oxide is arranged between the sealed bag and the first sealing member;

[0068] The outer side of the first sealing member is provided with an anti-oxidation layer with a thickness of 1.5mm; the anti-oxidation layer is a gel layer uniformly doped with metal powder; the metal powder is zinc powder with a...

Embodiment 2

[0076] This embodiment provides a method for sealing and packaging a copper target, and the method for sealing and packaging includes the following steps:

[0077] Place the copper target in a sealed bag;

[0078] A first sealing member and a second sealing member are sequentially sleeved outside the sealed bag; the first sealing member and the second sealing member are respectively independently plastic films with a thickness of 100 μm; the tensile strength of the plastic film is 60N / 15mm ;

[0079] Argon is filled in the sealed bag, between the sealed bag and the first sealing member, and in the cavity surrounded by two adjacent layers of sealing members; a desiccant calcium oxide is arranged between the sealed bag and the first sealing member;

[0080] The outer side of the first sealing member is provided with an anti-oxidation layer with a thickness of 1mm; the anti-oxidation layer is a gel layer uniformly doped with metal powder; the metal powder is zinc powder, aluminu...

Embodiment 3

[0088] This embodiment provides a method for sealing and packaging a copper target, and the method for sealing and packaging includes the following steps:

[0089] Place the copper target in a sealed bag;

[0090] A first sealing member and a second sealing member are sequentially sleeved outside the sealed bag; the first sealing member and the second sealing member are independently plastic films with a thickness of 200 μm; the tensile strength of the plastic film is 60N / 15mm ;

[0091] Argon is filled in the sealed bag, between the sealed bag and the first sealing member, and in the cavity surrounded by two adjacent layers of sealing members; a desiccant calcium oxide is arranged between the sealed bag and the first sealing member;

[0092] The outer side of the first sealing member is provided with an anti-oxidation layer with a thickness of 2 mm; the anti-oxidation layer is a gel layer uniformly doped with metal powder; the metal powder is zinc powder, aluminum powder wit...

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Abstract

The invention provides a sealed packaging method for a copper target material. The sealed packaging method comprises the steps that the a copper target material is placed in a sealed bag; at least two layers of sealing pieces sleeve the sealed bag; protective gas is filled in the sealed bag, between the sealed bag and the sealing pieces and in a cavity enclosed by two adjacent layers of sealing pieces; and an anti-oxidation layer is arranged on the outer side of the innermost sealing piece. According to the sealed packaging method for the copper target material, through the arrangement of the anti-oxidation layer, the copper target material can be stored for a long time; when the anti-oxidation layer needs to be replaced, only the sealing pieces provided with the anti-oxidation layer need to be replaced; and the sealed packaging method is simple and easy to implement, and industrial popularization and application are facilitated.

Description

technical field [0001] The invention belongs to the technical field of semiconductors and relates to a packaging method, in particular to a method for sealing and packaging copper targets. Background technique [0002] Magnetron sputtering is a substrate coating process that uses charged particles to bombard the target, causing the target atoms to overflow from the surface and evenly deposit on the substrate. Magnetron sputtering has become one of the excellent substrate coating processes due to its advantages of high sputtering rate, low substrate temperature rise, good film-substrate bonding force, excellent metal coating uniformity and strong controllability. Magnetron sputtering is widely used in the coating process of chip manufacturing, liquid crystal display manufacturing and solar cell manufacturing and other industries. [0003] Taking the copper target as an example, during the sputtering process of the copper target, the ions generated by the ion source are accel...

Claims

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Application Information

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IPC IPC(8): B65D30/08B65D30/10B65D33/00B65D81/20B65D85/50B65D81/26
CPCB65D31/00B65D33/00B65D81/2069B65D85/50B65D81/26
Inventor姚力军窦兴贤王学泽王青松胡全
Owner合肥江丰电子材料有限公司