Ultrasonic sensor and buffer mounting mechanism

A technology for installing mechanisms and sensors, which is applied in the direction of transmitting sensing components, instruments, and measuring devices using wave/particle radiation devices. Shock-absorbing effect, guaranteed service life, and improved resistance

Pending Publication Date: 2021-09-03
AUDIOWELL ELECTRONICS GUANGDONG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a buffer installation mechanism for the failure of the shock abs

Method used

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  • Ultrasonic sensor and buffer mounting mechanism
  • Ultrasonic sensor and buffer mounting mechanism
  • Ultrasonic sensor and buffer mounting mechanism

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0022] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

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Abstract

The invention relates to an ultrasonic sensor and a buffer mounting mechanism. The buffer installation mechanism comprises an installation shell and a reinforcing piece, the installation shell is used for installing a piezoelectric mechanism, and the side wall of the installation shell is a first side wall and a second side wall which are sequentially formed from the bottom of the installation shell in the axial direction of the installation shell. The radial thickness of the first side wall along the mounting shell is greater than that of the second side wall along the mounting shell, and the reinforcing piece is arranged in the mounting shell and abuts against the first side wall in an attached mode. According to the buffer mounting mechanism, the radial thickness of the first side wall along the mounting shell is greater than the radial thickness of the second side wall along the mounting shell, the capability of resisting vibration of the piezoelectric mechanism by the first side wall can be improved, and meanwhile, the cushioning effect of the first side wall can be further improved by directly attaching and abutting the reinforcing piece to the first side wall. The service lives of the ultrasonic sensor and the buffer mounting mechanism are ensured.

Description

technical field [0001] The invention relates to the technical field of ultrasonic sensors, in particular to an ultrasonic sensor and a buffer installation mechanism. Background technique [0002] When the ultrasonic sensor is in operation, the piezoelectric material inside the mounting shell will vibrate, and the mounting shell will vibrate together with the piezoelectric material. At present, in order to prevent the side wall of the installation housing from vibrating with the piezoelectric material, the traditional ultrasonic sensor will add reinforcement materials (such as: metal blocks) inside the installation housing, and at the same time add reinforcement between the reinforcement material and the side wall of the installation housing. A buffer material (such as elastic resin or rubber, etc.) is provided, but when the buffer material ages, the shock absorption effect of the side wall of the ultrasonic sensor will fail, thereby affecting the service life of the ultrason...

Claims

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Application Information

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IPC IPC(8): G01D5/48G01D11/00G01D11/24
CPCG01D5/48G01D11/00G01D11/24
Inventor 叶鹏杨顺钊陈富
Owner AUDIOWELL ELECTRONICS GUANGDONG
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