Unlock instant, AI-driven research and patent intelligence for your innovation.

Lithographic apparatus, metrology apparatus, optical system and method

An optical system and measurement technology, applied in the direction of optics, instruments, photoplate making process of pattern surface, etc., can solve problems such as device function failure and electrical problems

Pending Publication Date: 2021-10-26
ASML HLDG NV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The error may cause problems in the function of the device, including failure of the device function, or one or more electrical problems of the functional device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lithographic apparatus, metrology apparatus, optical system and method
  • Lithographic apparatus, metrology apparatus, optical system and method
  • Lithographic apparatus, metrology apparatus, optical system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] This specification discloses one or more embodiments that incorporate the features of this invention. The disclosed embodiments are merely illustrative of the invention. The scope of the invention is not limited to the disclosed embodiments. The invention is defined by the appended claims.

[0025] Embodiments are described, and references in the specification to "one embodiment," "an embodiment," "example embodiment," etc., indicate that the described embodiments may include a particular feature, structure, or characteristic but may not necessarily every Each embodiment includes a specific feature, structure or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. In addition, when a particular feature, structure or characteristic is described in conjunction with an embodiment, it should be understood that it is within the scope of those skilled in the art to implement such feature, structure or characteristic in combination wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method to reduce sensitivity of a level sensor, arranged to measure a height of a substrate, to variations of a property of an optical component in the level sensor includes directing a beam of radiation toward a diffractive element and directing the beam, via an optical system, to a first reflective element at a first angle of incidence. The beam has a first polarization and a second polarization that is perpendicular to the first polarization. The first reflective element reflects the beam toward a second reflective element at a second angle of incidence causing the beam to impinge on the substrate. The first and second angles of incidence are selected to reduce variations of a ratio of intensities of the first polarization to the second polarization of the beam imparted by a property of a layer of at least one of the first and second reflective elements.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application No. 62 / 818,054, filed March 13, 2019, which is incorporated herein by reference in its entirety. technical field [0003] The present disclosure relates to metrology equipment and systems, eg, position sensors for lithographic equipment and systems. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually onto a target portion of the substrate. A lithographic apparatus may be used, for example, in the fabrication of integrated circuits (ICs) or other devices designed to function. In such cases, a patterning device (which is alternatively referred to as a mask or reticle) may be used to create a circuit pattern to be formed on a single layer of a device designed for function. This pattern can be transferred onto a target portion (eg, a portion including a die, a die or several dies) o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F9/00
CPCG03F9/7034G03F9/7096G03F9/7065
Inventor S·斯米诺夫
Owner ASML HLDG NV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com