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Stress luminescence measurement device and stress luminescence measurement method

A technology of stress luminescence and measuring device, which is applied in measuring device, using optical device, and measuring force by measuring the change of optical properties of materials when they are stressed, and can solve problems such as sample breakage.

Inactive Publication Date: 2021-11-19
SHIMADZU SEISAKUSHO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above test, if a defect is generated in the sample, strain will occur around the defect, and the sample may reach fracture

Method used

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  • Stress luminescence measurement device and stress luminescence measurement method
  • Stress luminescence measurement device and stress luminescence measurement method
  • Stress luminescence measurement device and stress luminescence measurement method

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0025]

[0026] figure 1 It is a block diagram showing the overall configuration of the stress luminescence measurement device according to the first embodiment. The stress luminescence measurement device 100 according to Embodiment 1 is a device for measuring stress (strain) generated in a test object 1 (hereinafter also simply referred to as "sample") by using the luminescence phenomenon of a stress luminometer. The stress luminescence measurement device 100 can also be used to test durability against stress generated in the sample 1 .

[0027] Sample 1 is flexible, such as a flexible sheet or a flexible fiber. The flexible sheet can constitute a part of a flexible display of a communication terminal such as a smartphone or a tablet or a wearable device. Flexible fibers can form part of, for example, fiber optic cables.

[0028] exist figure 1 In the example, Sample 1 is a flexible sheet of rectangular shape. A stress light emitter 2 is disposed on the surface of the ...

Embodiment approach 2

[0096] In Embodiment 1, based on a relational expression or table obtained in advance (refer to image 3 ) has been described as a configuration for calculating the bending angle θ of the sample 1 at the imaging timing, but it may also be a configuration for calculating the bending angle θ of the sample 1 from the captured image P1 obtained by the camera 40 .

[0097] In Embodiment 2, a method of calculating the bending angle θ of the sample 1 from the captured image P1 will be described. In addition, in Embodiment 2 and later, the structure of the stress luminescence measurement device 100 is the same as figure 1 The illustrated stress luminescence measurement device 100 has the same structure, so the description thereof will not be repeated. In addition, in addition to the step of obtaining the bending angle θ of sample 1 ( Figure 5 In addition to S40), the process of stress luminescence measurement is the same as Figure 5 The flowcharts shown are the same, and therefor...

Embodiment approach 3

[0110] In the stress luminescence measurement method according to Embodiment 3, the imaging timing of the camera 40 is set according to the bending angle θ of the sample 1 . Figure 10 It is a timing chart for explaining the operations of the light source 31 , the camera 40 , and the holder 10 in the stress luminescence measurement device 100 according to the third embodiment. exist Figure 10 In , waveforms showing timing of irradiation of excitation light from light source 31 , waveforms showing timing of imaging by camera 40 , and waveforms showing timing of operation of holder 10 by first driver 20 are shown.

[0111] Such as Figure 10 As shown, when imaging by the camera 40 starts at time t3, still images of the number corresponding to the frame rate of the camera 40 are generated. In Embodiment 3, the test is stopped for every frame, and the sample 1 is photographed by the camera 40 while maintaining the bending angle θ at the stop timing.

[0112] Specifically, by d...

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Abstract

The invention relates to a stress luminescence measurement device and a stress luminescence measurement method. The stress luminescence measurement device according to a first aspect is provided with a load application mechanism configured to deform a sample (1) by applying a load to the sample (1), a light source (31) configured to emit excitation light to a stress luminescent object (2) arranged on a surface of the sample (1), a camera (40) configured to image luminescence of the stress luminescent object (2), and a controller (50) configured to control the load application mechanism, the light source (31), and the camera (40). The controller (50) acquires a deformation state of the sample (1) at the imaging timing by the camera (40) and stores the acquired deformation state of the sample (1) in association with the image captured by the camera (40) in a memory (502).

Description

technical field [0001] The invention relates to a stress luminescence measuring device and a stress luminescence measuring method. Background technique [0002] At the development site of flexible devices, the durability and performance of the samples are generally verified by repeatedly applying loads to the samples using a deformation tester. In the above-mentioned test, if a defect is generated in the sample, the periphery of the defect may be strained, and the sample may be broken. [0003] In recent years, as a technique for detecting such defects, a technique using a stress illuminant has been proposed. For example, Japanese Patent Application Laid-Open No. 2015-75477 discloses a stress luminescence evaluation device that measures and evaluates the luminous intensity of a stress luminaire. In Patent Document 1, a stress light emitter is arranged on the surface of a sample, and an external force is applied to the stress light emitter together with the sample to cause ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/02G01N3/08G01L1/24G01B11/16
CPCG01N3/02G01N3/08G01L1/24G01B11/16G01N3/32G01N3/20G01N2203/006G01N2203/0647G01N2203/0282G01N2203/0023G01N2203/0005G01N21/70
Inventor 横井祐介山川伦誉藤原直也津岛启晃足立健太
Owner SHIMADZU SEISAKUSHO CO LTD
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