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Equipment front end modules including multiple aligners, assemblies, and methods

A technology for equipment front-end modules and equipment, which is used in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., and can solve problems such as substrate throughput limitations

Active Publication Date: 2021-12-03
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some cases, existing EFEMs have certain substrate throughput limitations

Method used

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  • Equipment front end modules including multiple aligners, assemblies, and methods
  • Equipment front end modules including multiple aligners, assemblies, and methods
  • Equipment front end modules including multiple aligners, assemblies, and methods

Examples

Experimental program
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Embodiment Construction

[0018] Reference will now be made in detail to the example embodiments provided, examples of which are illustrated in the accompanying drawings. The features of the various embodiments described herein may be combined with each other unless specifically stated otherwise.

[0019] In substrate processing in the manufacture of electronic devices, an equipment front-end module (EFEM) receives substrates from one or more substrate carriers. The substrate carrier can be docked to a loadport located on its front wall (eg, docked to a loadport configured on the front surface of the EFEM body). The EFEM may include an EFEM chamber formed at least in part by the EFEM body.

[0020] In order to properly position a substrate prior to transferring it to a processing chamber for processing, prior art EFEMs may include alignment pedestals that rotate the substrate into the proper rotational orientation prior to processing. In some embodiments, the EFEM may also include side storage compar...

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PUM

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Abstract

An equipment front end module may include an equipment front end module body forming an equipment front end module chamber. The equipment front end module body may include plurality of walls. One or more load locks or process chambers may be coupled to one or more first walls. One or more load ports may be provided in one or more second walls, wherein each of the one or more load ports are configured to dock a substrate carrier. A plurality of alignment pedestals may be housed within the equipment front end module chamber. A load / unload robot may be at least partially housed within the equipment front end module chamber, wherein the load / unload robot may include a plurality of blades. Other apparatus and methods are disclosed.

Description

technical field [0001] Embodiments of the present disclosure relate to equipment front end modules (EFEMs), electronic device processing components, and methods for operating equipment front end modules. Background technique [0002] Substrate processing in semiconductor device fabrication is performed in multiple process tools, with substrates being moved between process tools in a substrate carrier, such as a front opening pod (FOUP). The substrate carrier may be docked to the front wall of an equipment front end module (EFEM) including a loading / unloading robot. The load / unload robot is operable to transfer substrates between the substrate carrier and one or more destinations coupled to the rear wall of the EFEM opposite the front wall, such as a load lock or a process chamber. However, in some cases, existing EFEMs have certain substrate throughput limitations. Contents of the invention [0003] In some embodiments, a device front end module is provided. The equipme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/67
CPCH01L21/67775H01L21/67766H01L21/67706H01L21/67778H01L21/67781H01L21/67155H01L21/67196H01L21/67201H01L21/68H01L21/67017B65G47/904B65G47/907H01L21/67769H01L21/67745B65G47/90H01L21/68707
Inventor 尼古拉斯·迈克尔·伯甘茨
Owner APPLIED MATERIALS INC