Equipment front end modules including multiple aligners, assemblies, and methods
A technology for equipment front-end modules and equipment, which is used in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., and can solve problems such as substrate throughput limitations
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[0018] Reference will now be made in detail to the example embodiments provided, examples of which are illustrated in the accompanying drawings. The features of the various embodiments described herein may be combined with each other unless specifically stated otherwise.
[0019] In substrate processing in the manufacture of electronic devices, an equipment front-end module (EFEM) receives substrates from one or more substrate carriers. The substrate carrier can be docked to a loadport located on its front wall (eg, docked to a loadport configured on the front surface of the EFEM body). The EFEM may include an EFEM chamber formed at least in part by the EFEM body.
[0020] In order to properly position a substrate prior to transferring it to a processing chamber for processing, prior art EFEMs may include alignment pedestals that rotate the substrate into the proper rotational orientation prior to processing. In some embodiments, the EFEM may also include side storage compar...
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