Conductive adhesive, solid conductive adhesive film and preparation method and application thereof

A conductive adhesive film and conductive adhesive technology, applied in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of affecting the mechanical properties of conductive adhesive films, unfavorable mass industrial production, and high cost of conductive adhesives. Low, improved mechanical properties, excellent adhesion and aging properties

Active Publication Date: 2021-12-24
深圳市南科康达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the filling amount of the conductive filler in the conductive adhesive or conductive adhesive film provided in the prior art is relatively high, which will affect the mechanical properties of the conductive adhesive film, and will also make the cost of the conductive adhesive too high, which is not conducive to mass production. industrial production

Method used

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  • Conductive adhesive, solid conductive adhesive film and preparation method and application thereof
  • Conductive adhesive, solid conductive adhesive film and preparation method and application thereof
  • Conductive adhesive, solid conductive adhesive film and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A kind of conductive adhesive, its preparation raw material comprises following component according to weight part:

[0057]

[0058] The preparation method of the conductive adhesive provided in this example includes: dissolving polyurethane (Xieyu Chemical, PU408C) into N,N-dimethylformamide, so that the polyurethane is uniformly dispersed, and then adding epoxy resin E51, epoxy resin E20, dicyandiamide, silver-coated copper powder and polyaniline were mechanically stirred for 5 hours to obtain the conductive adhesive.

Embodiment 2

[0060] A kind of conductive adhesive, its preparation raw material comprises following component according to weight part:

[0061]

[0062]

[0063] Its preparation method is identical with embodiment 1.

Embodiment 3

[0065] A kind of conductive adhesive, its preparation raw material comprises following component according to weight part:

[0066]

[0067] Its preparation method is identical with embodiment 1.

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Abstract

The invention provides a conductive adhesive, a solid conductive adhesive film and a preparation method and application thereof. The conductive adhesive is prepared from the following raw materials in specific parts: thermoplastic resin, thermosetting resin, conductive filler, a conductive accelerant and a curing agent. According to the conductive adhesive, thermoplastic resin is matched with thermosetting resin to serve as a matrix, and specific parts of conductive filler and conductive accelerant are added, so that the conductive adhesive has excellent conductive performance under the condition that the addition amount of the conductive filler is relatively low, and further the conductive adhesive has excellent mechanical performance; and the solid conductive adhesive film prepared from the conductive adhesive also has relatively high bonding strength and aging resistance, and can be applied to connection of devices in a module.

Description

technical field [0001] The invention belongs to the technical field of conductive materials, and in particular relates to a conductive adhesive, a solid conductive adhesive film and a preparation method and application thereof. Background technique [0002] High-pixel camera modules are easily disturbed by external signals, so the light-receiving components need to increase the shielding requirements. connection for a stable electrical connection. [0003] The reinforcing plate is generally stainless steel plate, and the FPC plate is composed of polyimide film and gold fingers. It is required that the conductive adhesive film used for connection can be applied to the bonding of various materials, and it must achieve relatively high bonding performance while achieving bonding performance. High-performance conductivity and high stability, because the camera module needs to be operated at high temperature later, so after the adhesive is bonded, a lead-free reflow soldering tes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J9/02C09J7/10C09J7/30
CPCC09J163/00C09J9/02C09J7/10C09J7/30C08K2201/001C08K2003/085C08K2003/0806C09J2301/314C08L63/00C08L75/04C08L79/02C08K9/02C08K3/08
Inventor 田颜清郝长祥
Owner 深圳市南科康达科技有限公司
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