Ultra-fast large-view-field super-resolution fluorescence microscopic imaging system and imaging method

Abstract

The invention discloses an ultra-fast large-view-field super-resolution fluorescence microscopic imaging system, which comprises a laser system, an illumination light path, a microscope main body, a three-dimensional nanoscale sample locking module, a sample scanning module and an imaging module. Fluorescence wide-field imaging and super-resolution fluorescence imaging are performed on a sample through an imaging module, a deep neural network model is trained by using a super-resolution fluorescence imaging result, and a large-view-field super-resolution image is obtained based on the trained deep neural network model, a fluorescence wide-field imaging result and a super-resolution fluorescence imaging result. Under the condition of overall low-intensity illumination, a large-view super-resolution imaging result can be obtained, and compared with a single super-resolution imaging method, the imaging speed can be increased by n/m times; the method can overcome the defects that a super-resolution fluorescence microscopic imaging technology is low in shooting speed, limited in imaging view field and high in phototoxicity and photobleaching, has wide application prospects in the field of life science, and can achieve high-throughput living cell imaging.

Description

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AI Technical Summary

Benefits of technology

This patented technique uses an image processing system that improves resolution for small samples at different levels of brightness without affecting their quality or causing damage during analysis. It achieves this through deep convolutional neural networks trained on data from multiple sources such as images obtained with traditional techniques like scanning electron microscope (SEM) or laser confocal point spread function cameras.

Problems solved by technology

This patents describes different methods for creating higher quality digital tomography videos than current ones without sacrificial effects like damages caused by weak lights at longer wavelengths. These technical means include: 1) Structural Illumination Microscopy (SIM), 2) Time Expansion Microscope Interference Scattering Lifetime Imager (TEILISS IMI®), 3) Ultraviolet Light Emission Spectrofluorimetry (UVLSAR™), 4) High Intelligence Computational Quantification Group (HICG)-FISPix Viewer) Optical Probing (OPC)/Eletron Frigeration Angiology Magnetic Resonance Imagings (ESIMRI)) systems, 5) Ultrasound Fusion Transmission Assay (USFTA) technique, 6) Reflection Calibration Technique, 7) Lasers Direct Stimulation Inducous Dendrography (LDI) technique/Structuring Incidence Sampling Method (SMSQ), 8) Spatial Confocation Photometry (SCAL) technique called Structure Index Profiling (SPCP)).

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