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Inductor component
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A technology for inductors and components, applied in the field of inductor components, can solve problems such as damage to the internal structure of electronic components and insufficient insulation of electronic components
Pending Publication Date: 2022-03-01
MURATA MFG CO LTD
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Problems solved by technology
That is, the insulation of electronic components is insufficient in the state before they are mounted on a substrate or the like
Therefore, for example, when electronic components are stored, current may flow inside the electronic components due to static electricity, and the internal structure of the electronic components may be damaged.
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no. 1 approach ＞
[0047] Hereinafter, a first embodiment of the inductor component will be described. In addition, for the sake of easy understanding, the drawings may show components enlarged. The dimensional ratios of components may differ from actual dimensional ratios or dimensional ratios in other drawings.
[0048] like figure 1 As shown, the inductor component 10 as a whole has a structure in which five layers are stacked in the thickness direction Td. In addition, in the following description, one side in the thickness direction Td is set as an upper side, and the opposite side is set as a lower side.
[0049] The first layer L1 includes two inductor wirings 20 , first support wiring 41 and second support wiring 42 extending from each inductor wiring 20 , an inner magnetic circuit portion 51 , and an outer magnetic circuit portion 52 . In addition, in the following description, when it is necessary to distinguish two inductor wirings 20, one inductor wiring 20 is called a 1st inducto...
no. 2 approach ＞
[0150] Hereinafter, a second embodiment of the inductor component will be described. In addition, for the sake of easy understanding, the drawings may show components enlarged. The dimensional ratios of constituent elements may be different from actual scaled dimensions or scaled dimensions in other drawings. In addition, explanations may be simplified or omitted for the same configuration as that of the first embodiment.
[0151] like Figure 27 As shown, the inductor component 10 as a whole has a structure in which five layers are stacked in the thickness direction Td. In addition, in the following description, one side in the thickness direction Td is set as an upper side, and the opposite side is set as a lower side.
[0152] The first layer L1 includes a first inductor wiring 20R, a second inductor wiring 20L, a first supporting wiring 41 , a second supporting wiring 42 , an inner magnetic circuit portion 51 , and an outer magnetic circuit portion 52 .
[0153] When v...
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Abstract
Provided is an inductor component in which current does not flow between external terminals before the inductor component is mounted on a substrate or the like. The inductor wiring (20) extends inside the body (BD). The first vertical wiring (71) is connected to the inductor wiring (20). The upper surface of the first vertical wiring (71) is exposed from the main surface (MF) of the element (BD). A first external terminal (81) is laminated on the upper surface of the first vertical wiring (71). The first external terminal (81) has a first conductive section (81A) and a first insulating section (81B). The first conductive section (81A) is insulated from the outside of the element (BD) by the first insulating section (81B).
Description
technical field [0001] The present disclosure relates to inductor components. Background technique [0002] The electronic component described in Patent Document 1 has a main surface and has a rectangular body. External terminals are stacked on both sides in the longitudinal direction of the green body. Therefore, the external terminals become so-called five-face electrodes. The surfaces of the external terminals covering the side surfaces of the external terminals covering the main surface of the base body and the side surfaces perpendicular to the end surfaces are insulated by being covered with the insulating layer. [0003] Patent Document 1: Japanese Unexamined Patent Publication No. 2012-256758 [0004] In the electronic component described in Patent Document 1, although a part of the external terminal is covered with an insulating layer, most of the external terminal is exposed. That is, the insulating property of the electronic component is insufficient in a stat...
Claims
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Application Information
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