Three-dimensional heat transfer structure and device

Abstract

The invention provides a three-dimensional heat transfer structure and device, and particularly relates to the field of heat dissipation. The problem that when a working medium flows back into a vapor chamber from a heat pipe, the cross sectional area of a flowing channel is small is solved, and the heat dissipation performance of a high-power-consumption chip is improved. The three-dimensional heat transfer structure comprises a vapor chamber and a heat pipe, the vapor chamber comprises a first cavity, the heat pipe comprises a second cavity, the second cavity is communicated with the first cavity, and the heat pipe and the vapor chamber are connected in a sealed mode. A VC capillary structure is arranged on the inner wall of the first cavity, a hollow heat pipe capillary structure is arranged in the second cavity, the outer wall of the heat pipe capillary structure is attached to the inner wall of the second cavity, and one end of the heat pipe capillary structure is connected with the VC capillary structure. The hollow part of the heat pipe capillary structure is provided with a capillary connecting structure, and the capillary connecting structure at least comprises a first face connected with the inner wall of the heat pipe capillary structure and a second face connected with the VC capillary structure.

Description

technical field [0001] The present application relates to the field of heat dissipation, in particular to a three-dimensional heat transfer structure and device. Background technique [0002] The performance of current electronic products is improving day by day to meet the growing demands of consumers. The performance of electronic products is greatly affected by the capability of the chip. Generally, the faster the calculation speed of the chip, the stronger the performance, but the greater the heat generated by the chip. If the heat of the chip cannot be effectively dissipated, it may cause the chip to overheat, resulting in the chip's down-frequency operation or even burning out. [0003] Vapor Chamber (VC) is a commonly used structure to solve the problem of chip heat dissipation. VC can be used to solve the problem of two-dimensional heat diffusion. Its equivalent thermal conductivity is more than 10 times that of pure copper, and it can be concentrated on the chip. ...

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a three-dimensional heat transfer structure and device, which can solve the problem that the cross-sectional area of ​​the flow channel is small when the working fluid flows back from the heat pipe to the vapor chamber, thereby improving the heat dissipation performance of the high-power consumption chip

Images