Fabrication Process of Flexible Lead Frames Avoiding Blind Via Plating

A technology of flexible lead and preparation process, which is applied in the fields of printed circuit manufacturing, circuit, printed circuit, etc., can solve problems such as the difficulty in electroplating of flexible lead frame pressure welding holes, achieve the goal of increasing the electroplating rate, solving the problem of missed plating, and improving product quality Effect

Active Publication Date: 2022-06-24
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a flexible lead frame preparation process that avoids blind hole electroplating, convert blind hole electroplating into plane electroplating, and fundamentally solve the problem of difficult electroplating of flexible lead frame pressure welding holes. No missing plating occurs on the lead frame

Method used

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  • Fabrication Process of Flexible Lead Frames Avoiding Blind Via Plating

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] The flexible lead frame is prepared by the process of the present invention, and the process flow is:

[0049] (1) First conduct electroplating on the back of the conductive metal layer:

[0050] ①Press dry film for the first time: Use film pressing equipment to stick photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 90℃, pressure 0.1Mpa, speed 1m / min.

[0051] ②The first exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 10mw / cm 2 , the exposure time is 10s.

[0052] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the pressure welding hole, that is,...

Embodiment 2

[0070] The flexible lead frame is prepared by the process of the present invention, and the process flow is:

[0071] (1) First conduct electroplating on the back of the conductive metal layer:

[0072] ①The first time to dry the film: use the film pressing equipment to stick the photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are the temperature of 100℃, the pressure of 0.3Mpa, and the speed of 3m / min.

[0073] ②The first exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 30mw / cm 2 , the exposure time is 5s.

[0074] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the p...

Embodiment 3

[0092] The flexible lead frame is prepared by the process of the present invention, and the process flow is:

[0093] (1) First conduct electroplating on the back of the conductive metal layer:

[0094] ①Press dry film for the first time: Use film pressing equipment to stick photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 110℃, pressure 0.5Mpa, speed 5m / min.

[0095] ②The first exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 50mw / cm 2 , the exposure time is 1s.

[0096] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the pressure welding hole, that is,...

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Abstract

The invention belongs to the technical field of preparation of flexible lead frames, and in particular relates to a preparation process of flexible lead frames which avoids blind hole electroplating. The process flow is as follows: first conduct electroplating on the back of the conductive metal layer: conductive metal layer → first dry film pressing → first exposure → first development → plating and welding surface → first film removal; Layer front electroplating: substrate punching→attaching conductive metal layer→baking→second drying film→second exposure→second development→etching→second film removal→third drying film→second Three times of exposure → third development → plating contact surface → third film removal; wherein, the plated pressure welding surface and the plated contact surface are both planar electroplating. The invention transforms blind hole electroplating into plane electroplating, fundamentally solves the problem of difficult electroplating of flexible lead frame pressure welding holes, and the prepared flexible lead frame has no missing plating.

Description

technical field [0001] The invention belongs to the technical field of flexible lead frame preparation, and in particular relates to a flexible lead frame preparation process for avoiding blind hole electroplating. Background technique [0002] Flexible lead frames are mainly used in electronic information technology, integrated circuit IC card packaging field. As the chip carrier of the integrated circuit, the lead frame is a key structural member that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. As a bridge to connect with external wires, lead frames are required in most semiconductor integrated blocks, which are important basic materials in the electronic information industry. Therefore, the flexible lead frame has strict quality requirements. [0003] Commonly used flexible lead frame structures such as ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/02C25D5/12C25D3/12C25D3/48H01L21/48H05K3/06H05K3/18
CPCC25D5/022C25D5/12C25D3/12C25D3/48H01L21/4821H05K3/061H05K3/188
Inventor 任志军邵汉文张成彬于艳邢树楠
Owner 新恒汇电子股份有限公司
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