Flexible lead frame preparation process capable of avoiding blind hole electroplating
A flexible lead and preparation process technology, applied in printed circuit manufacturing, circuits, printed circuits, etc., can solve the problems of difficult electroplating of pressure-welding holes of flexible lead frames, and achieve the effect of improving electroplating rate, high efficiency, and stable electroplating process.
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Embodiment 1
[0048] Adopt technology of the present invention to prepare flexible lead frame, technological process is:
[0049] (1) Conduct electroplating on the back of the conductive metal layer first:
[0050] ① Dry film pressing for the first time: Use lamination equipment to attach photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 90°C, pressure 0.1Mpa, and speed 1m / min.
[0051] ②First exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 10mw / cm 2 , the exposure time is 10s.
[0052] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the welding hole, that is, the pos...
Embodiment 2
[0070] Adopt technology of the present invention to prepare flexible lead frame, technological process is:
[0071] (1) Conduct electroplating on the back of the conductive metal layer first:
[0072] ① Dry film pressing for the first time: Use film pressing equipment to attach photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 100°C, pressure 0.3Mpa, and speed 3m / min.
[0073] ②First exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 30mw / cm 2 , the exposure time is 5s.
[0074] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the welding hole, that is, the ...
Embodiment 3
[0092] Adopt technology of the present invention to prepare flexible lead frame, technological process is:
[0093] (1) Conduct electroplating on the back of the conductive metal layer first:
[0094] ① Dry film pressing for the first time: Use lamination equipment to attach photosensitive film on the upper and lower surfaces of the conductive metal layer. The pressing parameters of the photosensitive film are temperature 110°C, pressure 0.5Mpa, and speed 5m / min.
[0095] ②First exposure: Use exposure equipment to expose the position of the non-pressure welding hole on the photosensitive film. The exposure light source is 5000W ultraviolet parallel light, and the exposure light intensity is 50mw / cm 2 , the exposure time is 1s.
[0096] ③The first development: Use a developing device with a spray function, use a weak alkaline chemical solution (sodium carbonate), remove the unexposed photosensitive film, and leak the position corresponding to the welding hole, that is, the pos...
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