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Functional double faced adhesive tape forming processing technology

A technology of forming processing and double-sided adhesive tape is applied in the field of processing technology to achieve the effect of saving manpower and material costs

Active Publication Date: 2022-07-05
SUZHOU DAXIANG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Functional composite materials are combined with adhesive auxiliary materials to prepare a tape structure with protective film, release film, and double-sided adhesive tape, which are supplied to automated equipment for stamping and mounting on the surface of the circuit board to play the roles of shielding, conduction, and reinforcement. The material is coil material and the waste of material cannot be avoided

Method used

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  • Functional double faced adhesive tape forming processing technology

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Experimental program
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Effect test

Embodiment Construction

[0012] like figure 1 As shown, a functional double-sided adhesive forming processing technology, the technology includes the following steps:

[0013] Step 1: Adhere the double-sided adhesive tape 1, the first carrier film 2 and the second carrier film 3 in sequence to obtain a three-layer film finished product;

[0014] Step 2: The finished three-layer film in step 1 is punched by knife rollers with deep and shallow intervals to obtain the finished three-layer film punched to the 2nd side of the first carrier film and to the 3rd side of the second carrier film. Punch out three-layer film finished products;

[0015] Step 3: peel off the finished three-layer film punched in step 2 to obtain a two-layer film to be processed with the first double-sided tape 11 and the first carrier film 2 bonded, and the second double-sided tape 12 bonded with the film to be processed. , the three-layer films to be processed of the first carrier film 2 and the second carrier film 3 are separate...

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Abstract

The invention relates to a processing technology, in particular to a functional double-faced adhesive tape forming processing technology which comprises the following steps: sequentially bonding a double-faced adhesive tape, a first bearing film and a second bearing film to obtain a three-layer film finished product; the three-layer film finished product obtained in the first step is punched through a knife roll with the depth spaced, and the three-layer film finished product punched to a first bearing film face and punched to a second bearing film face is obtained; a first double-layer film finished product bonded with the first composite film and the first double-faced adhesive tape is obtained; the first bearing film and the second bearing film are peeled off from the three to-be-processed films peeled off in the step 3 through the second composite film, and a second double-layer film finished product bonded with the second composite film and the second double-faced adhesive tape is obtained. The product is divided into two products which are completely consistent and have the sizes meeting the typesetting requirements of customers through one-time die cutting, and meanwhile manpower and material cost are saved.

Description

technical field [0001] The invention relates to a processing technology, in particular to a processing technology for forming a functional double-sided adhesive tape. Background technique [0002] The functional composite material is matched with adhesive auxiliary materials to prepare a tape structure with protective film, release film and double-sided tape, which is supplied to automatic equipment for stamping and mounting on the surface of the circuit board, and plays the role of shielding, conduction and reinforcement. The material is coil material and the waste of material cannot be avoided. SUMMARY OF THE INVENTION [0003] Aiming at the deficiencies of the prior art, the present invention provides a functional double-sided adhesive forming process. [0004] In order to achieve the above purpose, the technical solution adopted by the present invention is: a functional double-sided adhesive forming process, the process comprises the following steps: [0005] Step 1:...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/74
CPCB29C65/74B29C66/45
Inventor 胡荣陈进财张祥
Owner SUZHOU DAXIANG NEW MATERIAL
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