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Solder-bearing wafer for usein soldering operations

A technology of solder and sheet, applied in the direction of welding equipment, connection, containing printed electrical components, etc., can solve the problems of increasing the cost and complexity of welding operations

Inactive Publication Date: 2005-05-25
NAS INTERPLEX IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Collets are typically formed by stamping, which results in increased cost and complexity to the overall welding operation

Method used

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  • Solder-bearing wafer for usein soldering operations
  • Solder-bearing wafer for usein soldering operations
  • Solder-bearing wafer for usein soldering operations

Examples

Experimental program
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Embodiment Construction

[0034] In a first aspect, the present invention simplifies the process of soldering electrical terminals or contacts of one electronic device to the surface of a second electronic device with a solder foil. In an exemplary embodiment, the electrical contacts include conductive pins and the second electronic device includes a printed circuit board. 1 to 3 illustrate a method of forming a sheet according to a first embodiment of the present invention.

[0035] Turning to FIG. 1, a wafer 100 is provided. The wafer 100 is made of any suitable material and preferably is made of a non-conductive material. For example, sheet 100 may be formed from a thermoplastic material, a thermoset, or the like. The sheet 100 has pin holes 110 formed therethrough. It goes without saying that the pin hole 110 does not necessarily have to be annular and that the pin hole 110 generally includes a small hole formed in the sheet 100 . by mounting on a second electronic device such as a printed circu...

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PUM

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Abstract

A solder foil (100) is provided for connecting a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and a second surface opposite the first surface. The first surface has a groove (115, 117) formed therein and includes a solder segment (130) disposed within the groove. When the solder is heated and a sheet is placed between the first and second devices, the two devices are connected.

Description

technical field [0001] The present invention relates to the field of devices for connecting connectors or other electrical components to each other, and more particularly to a method of facile soldering of a first electronic device, such as a connector, to a second electronic device, such as a printed circuit board and device. Background technique [0002] It is often necessary and desirable for one element to be electrically connected to another. For example, multi-terminal components such as connectors are often electrically connected to a substrate such as a printed circuit board such that the terminals of the component are securely secured to contact pads formed on the substrate to make electrical connections therebetween. A preferred technique for securely securing a component terminal to a contact pad is to use solder around a specific area, such as a hole, that would normally seat a component terminal. Typically, component terminals may take the form of conductive p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/16B23K3/08H01R43/02H05K3/34
CPCH01R43/0263B23K3/08H01R43/0235H05K3/3405H05K3/3447H05K3/3478H05K2201/09036H05K2201/10189H05K2201/10378H05K2201/10424H05K2203/0338H05K2203/0415
Inventor 约瑟夫·S·卡奇那詹姆斯·R·扎诺利
Owner NAS INTERPLEX IND