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Power supply layer of multilayer circuit board and circuit structure of computer system

A multi-layer circuit board and computer system technology, applied in data processing power supply, measurement device, measurement flow/mass flow, etc., can solve the problem of affecting system stability, signal high and low level fluctuations, power block 42 voltage level fluctuations And other issues

Inactive Publication Date: 2005-08-17
VIA TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] like image 3 As shown, the insulated line itself can be regarded as the boundary of the power supply block 32. Since the insulated line is not a smooth curve at the turning point, an acute angle will be generated at the boundary of the two adjacent power supply blocks 32a, 32b, and 32c. Adjacent power supply blocks 32 provide different voltage levels, so there is a voltage difference between two adjacent power supply blocks 32, so the acute angle of its boundary will further produce the effect of tip discharge, thus causing the voltage level of the power supply block 42 Because the power supply block 32 is used to provide the operating voltage of the computer components, if the operating voltage is unstable, it will cause fluctuations in the signal level and affect the stability of the overall system

Method used

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  • Power supply layer of multilayer circuit board and circuit structure of computer system
  • Power supply layer of multilayer circuit board and circuit structure of computer system
  • Power supply layer of multilayer circuit board and circuit structure of computer system

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Embodiment Construction

[0027] see Figure 4 , Figure 4 It is a schematic diagram of the power supply layer 40 of the motherboard according to the first embodiment of the present invention, wherein the present invention can be applied to technologies such as motherboards using DDR266 memory and motherboards of chipsets, which can reduce the generation of noise. The power supply layer 40 includes a plurality of power supply blocks 42 and a plurality of isolation lines 44. Each power supply block 42 is a conductive metal layer, and the insulating lines 44 are non-conductive materials for isolating two adjacent power supply regions. Block 42, since each power block 42 is used to provide a voltage level, the electronic components provided on the first signal layer (not shown), such as Figure 4 Illustrated central processing unit 46, north bridge chipset 48, south bridge chipset 50, memory 52 (eg, SDR or DDR dynamic random access memory), accelerated graphics port (AGP) 54, and peripheral components A...

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Abstract

The invention discloses a source layer containing the power block with smooth arc edge. It provides a multilayer circuit board, which includes at least a grounidng layer, at least a signal layer containing multiple traces to transmit signals, at least a source layer containing multiple power blocks, used to provide multiple voltage levels, and at least a connection hole, used to link the traces with the source or grounding layer. The adjacent power blocks with different voltages levels is separated by the insulating line which contains multiple first separating line segments and multiple smooth-curve second separating line segments, the second one used to link with adjacent first one whose tangent included angle is larger than a preset angle.

Description

technical field [0001] The present invention relates to a power supply layer of a multi-layer printed circuit board, in particular to a power supply layer including a power supply block with smooth arc-shaped boundary and a circuit structure of a computer system. Background technique [0002] Generally speaking, a printed circuit board (PCB) has been commonly used to assist the electrical connection between various electronic components, so as to facilitate the transmission of signals by the various electronic components. In the past, the printed circuit board was a single layer with only one signal plane on its surface, and the traces on the signal layer were used to connect all the mounts on the printed circuit board. The electronic component, that is, the output or input signal of the electronic component is transmitted through the trace. However, when a plurality of different signals are included between the electronic components, the signal layer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/26
Inventor 吴明洲戴继德黄明伟张建源
Owner VIA TECH INC
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