Parts installation device

Abstract

The present invention provides a part installation device for installing a part on a head to the object on a erecting floor and a vidicon for shooting the parts on the head and the object on the erecting floor; amending the relative position of the part and the object according to the position information from the vidicon; shortening the time without complicating the drive structure. A part delivering apparatus delivers parts to the head and installs the parts on the head' route and a reflection component of the vidicon is installed on the part delivering apparatus.

Description

technical field [0001] The present invention relates to a device for mounting electronic components such as chips on a printed circuit board or an object to be mounted, and more specifically to an apparatus for mounting electronic parts such as a chip to a heated printed circuit board or an object to be mounted such as a package . Background technique [0002] Figure 16 An example of a conventional component mounting device of this type is shown. The component mounting device uses the suction nozzle 34 of the mounting head 33 to hold the component 32 of the component supply part 31 and transport it to the top of the mounting table 35, and the imaging device 38 composed of a reflective member 36 such as a prism or a half mirror and a camera 37, etc. Enter between the mounting head 33 and the mounting table 35, take pictures of the parts 32 held on the mounting head 33 and the positions of the mounting object 39 on the mounting table 35 respectively, obtain the respective po...

AI Technical Summary

Problems solved by technology

[0007] According to this structure, although the problem in the structure of the previous example in which the mounting head is moved up and down and horizontally can be alleviated, there is a waiting time for avoiding interference between the parts conveying device and the imaging device, which causes a delay in tact time and requires more drive source, there are problems such as high equipment cost

[0008] Also, in the above Figure 18 In the conventional method shown, since one cycle of the mounting head includes two up and down motions, the takt time is long, which hinders the efficiency of the mounting process.

[0009] Therefore, according to such a conventional component mounting method, efforts have been made to increase the operating speed of the mounting head in order to shorten the tact time, but when using a mounting head that requires heating or pressurization during mounting, the size and weight of the mounting head will increase. , so the inertia is large, so the speed is also limited

[0010] In addition, when the mounting head is lowered to the part of the part conveying device during the delivery of the part from the part conveying device to the mounting head, there may be a large impact on the part due to the inertial force and gravity of the mounting head.

[0011] Moreover, although in the process of handing over parts from the parts conveying device to the mounting head, the form of raising the parts conveying device toward the mounting head and receiving the parts is compared with the above-mentioned form of lowering the mounting head to receive the parts. Shock is reduced, but this requires the time to raise the part transfer device and the time to lower the mounting head to receive the part, respectively, and the cycle time is longer

[0012] Also, in the above Figure 19 In the conventional apparatus shown, since the preheating stage 137 is used to preheat the subsequent mounting object 131, the temperature of the mounting object 131 decreases during the exchange of the tray 132 to the mounting table 134, so that it is not until the actual parts are processed. The time required for reheating on the mounting table 134 until the mounting process is required, and the reheating time is required in addition to the pallet exchange time, and the takt time becomes longer

[0013] And, in the above Figure 19 In the conventional apparatus shown, since the bonding temperature between the chip 136 and the object to be mounted 131 is high, the temperature of the object to be mounted 131 drops sharply while the tray 132 is being exchanged on the mounting table 134, so the temperature drop loss is even greater. Therefore, the time for reheating on the mounting table 134 until the actual parts mounting process needs to be longer

Therefore, the time for moving the tray 132 on the preliminary heating table 137 into the installation table 134 and the time for reheating to the above-mentioned joining temperature, that is, the time lost, takes about 40 seconds, so the takt time is longer and the operating efficiency is high. Difference

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