Lift type substrate treatment device, and substrate treatment system with the substrate treatment device

Abstract

A lift type substrate treatment device having a function to transfer a substrate from one to the other side of a treatment line and capable of treating the substrate during transfer, and a substrate treatment system having the lift type substrate treatment device; the lift type substrate treatment device, comprising a cabinet-like cover body (11) having a substrate inlet (11a) and a substrate outlet (11b) provided therein parallel with each other in vertical direction, a transfer supporting means forming a treatment mechanism (20) installed in the cover body (11), supportedly accepting the substrate carried in from the substrate inlet (11a), and discharging the substrate from the substrate outlet (11b), a support frame (21) for supporting the transfer / supporting means, the treatment mechanism (20) disposed above the transfer / supporting means and having a treatment fluid discharge means for discharging the treatment fluid onto the substrate, and a lifting mechanism (40) for supportedly lifting the treatment mechanism (20) in vertical direction to move the treatment mechanism (20) to the substrate inlet (11a) and the substrate outlet (11b).

Description

technical field [0001] The present invention relates to a processing device for performing predetermined processing while moving (transporting) various substrates such as semiconductor (silicon) wafers, liquid crystal glass substrates, glass substrates for photomasks, substrates for optical disks, and multiple A substrate processing system composed of two processing devices connected together. Background technique [0002] For example, there are wet process treatments in the manufacturing process of liquid crystal glass substrates, such as the coating of developing solution, the coating of etching solution, the coating of stripping liquid for peeling off the photoresist film, etc., and between each wet process treatment Then there are washing treatment and drying treatment. [0003] Regarding the processing apparatus for performing the above-mentioned respective processes, there is a conventional processing apparatus that mounts a substrate on conveying rollers and performs...

AI Technical Summary

Problems solved by technology

[0014] That is, if Figure 10 As shown, when the substrate K is subjected to etching treatment in the first processing unit 206 and then transported in an unwashed state, the etching progresses due to variations in the transport time required for transport to the second processing unit 207. The degree varies, and the etching process cannot be controlled with high precision

Since the substrate conveying part 210 has a complex action mechanism composed of the lifting mechanism of the substrate K and the moving mechanism of the second conveying roller 216, it is extremely difficult to control the conveying time with high precision.

[0015] Also, for example, when the cleaning process is used as the final process of the first processing unit 206, when the substrate K is transported in a non-dried state, the surface will be dried unevenly or stains will occur, making the substrate K a defective product.

[0016] Moreover, in the conventional substrate processing system 200, the two processing lines of the first processing unit 206 and the second processing unit 207 are arranged in parallel, so there is also a problem that the installation efficiency of the device is poor.

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