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Electronic part with a lead frame

一种电子部件、引线框架的技术，应用在固体电解电容器领域，能够解决电容器特性变差等问题

Inactive Publication Date: 2006-08-09
SANYO ELECTRIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If a crack occurs on the lead frame 9, 90, capacitor characteristics such as ESR will deteriorate

Method used

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  • Electronic part with a lead frame
  • Electronic part with a lead frame
  • Electronic part with a lead frame

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0029] An example of the present invention will be described in detail below using the accompanying drawings.

[0030] The structure of the capacitor element 5 is the same as the conventional structure. This example is characterized in that the ribs 72 supporting the base ends of the lead frames 9 , 90 protrude from the lower half case 71 .

[0031] figure 1 is a front view of a solid electrolytic capacitor according to the present invention in which the second sheet 92 is bent downward. The casing 7 has an upper half casing 70 and a lower half casing 71 , and the lower half casing 71 is formed to have a shorter lateral length than the upper half casing 70 at the boundary position between the two half casings 70 , 71 . That is, at the protruding positions of the lead frames 9 , 90 , the lateral length L2 of the upper surface of the lower half case 71 is formed to be shorter than the lateral length L1 of the lower surface of the upper half case 70 .

[0032] A rib 72 protru...

no. 2 example

[0039] image 3The middle rib 72 is disposed on the inside of the upper half case 70 . As a result, at the time of bending processing of the lead frame 9, as image 3 As shown in part D in the middle, the lead frame 9 is separated from the upper half case 70 . Separation residues of the upper half case 70 adhere to the lead frame 9, not only resulting in poor appearance, but also if the separation residues are peeled off, they adversely affect the electronic components arranged at the periphery of the solid electrolytic capacitor.

[0040] Therefore, the inventor makes the following design. Figure 4 and Figure 5 It is a perspective view showing another solid electrolytic capacitor. Such as Figure 4 As shown, a concave strip 85 is provided on the side surface of the upper half-shell 70 in the upward and downward direction, and the lead frame 9 is located in the lower end of the concave strip 85 . The ribs 72 are located on the underside of the lead frame 9 .

[0041] ...

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PUM

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Abstract

An electronic component comprises an upper half housing segment 70 and a lower half housing segment 71. A lead frame 9 to be bent downward toward the lower housing segment 71 projects laterally from an upper end portion of the lower housing segment 71. Projecting from a side wall upper end portion of the lower housing segment 71 is a rib piece 72 in contact with the lower surface of base end portion of the lead frame 9 and plastically deformable when subjected to a bending force to be applied to the base end portion when the lead frame 9 is bent.

Description

technical field [0001] The present invention relates to an electronic component protruding from the side with a lead frame, in particular to a solid electrolytic capacitor. Background technique [0002] Figure 7 is a perspective view showing the process of manufacturing a chip-type solid electrolytic capacitor, Figure 8 is truncated by the face containing the A-A line Figure 7 A cross-sectional view of a medium capacitor (refer to Japanese Patent Publication Publication Hei 3-30977). [0003] solid electrolytic capacitors, such as Figure 8 As shown, the capacitor body 8 is covered by a case 7 made of synthetic resin, specifically, a thermosetting resin such as epoxy resin, and two lead frames 9, 90 electrically connected to the capacitor body 8 are connected from both sides of the case 7. Protrude outward. The case 7 is constituted by having an upper half case 70 on a lower half case 71, and the lead frames 9, 90 are composed of an alloy mainly composed of iron and ni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28H01G2/06H01L21/48H01L23/31H01L23/50
CPCH01L21/4842H01L2924/19041H01L2924/0002H01L23/3107H01L2924/00
Inventor 加藤千博松崎健一郎
Owner SANYO ELECTRIC CO LTD