Flexible circuit board
A technology for flexible circuit boards and circuit layers, applied in printed circuits, electrical components, etc., can solve the problems of low switch sensitivity, poor waterproof effect, and insufficient switch sensitivity
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no. 1 example
[0055] The first embodiment of the flexible circuit board 30 of the present invention is shown in FIG. 3 a , including: a first circuit layer 31 , a second circuit layer 32 , a spacer layer 35 , a first adhesive layer 33 and a second adhesive layer 34 .
[0056] The first circuit layer 31 has a plurality of first through holes 311, a plurality of first switches 312, and a first circuit 313 for electrically connecting the first switches 312. The second circuit layer 32 has a plurality of holes corresponding to the first through holes 311. A plurality of second through holes 321, a plurality of second switches 322 corresponding to the first switches 312, and a second line 323 for electrically connecting the second switches 322, and the second circuit layer 32 is characterized by its second The switch 322 and the first switch 312 are arranged in a facing manner, that is, the second switch 322 is arranged on the surface facing the first circuit layer 31, and the first switch 312 is a...
no. 2 example
[0065] The second embodiment of the flexible circuit board 40 of the present invention is shown in Figures 4a and 4b, including: a first circuit layer 41, a second circuit layer 42, a spacer layer 45, a first adhesive layer 43 and a second adhesive layer 44; Several first through holes 411, several first switches 412, and several first lines 413 for electrically connecting the first switches are provided on the first circuit layer 41, and several first circuits 413 are provided on the second circuit layer 42. Two through holes 421, a plurality of second switches 422 and a plurality of second circuits 423 for electrically connecting the second switches, and a plurality of third through holes 451 and a plurality of fourth through holes 452 are arranged on the spacer layer 45 ; The composition of the above-mentioned elements is substantially the same as that of the first embodiment, and its description is omitted here.
[0066] The difference between this embodiment and the first...
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