Flexible circuit board

A technology for flexible circuit boards and circuit layers, applied in printed circuits, electrical components, etc., can solve the problems of low switch sensitivity, poor waterproof effect, and insufficient switch sensitivity

Inactive Publication Date: 2003-02-19
DARFON ELECTRONICS CORP
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, due to the need for waterproofing, the thickness of the adhesive layer should be thick enough, but because the two adhesive layers are not mutually bonded, this will cause a poor waterproof effect; moreover, because the thickness of the adhesive layer must be thick enough, this will cause the switch to be sensitive. The degree is low, so that the switch is not sensitive enough

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit board
  • Flexible circuit board
  • Flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0055] The first embodiment of the flexible circuit board 30 of the present invention is shown in FIG. 3 a , including: a first circuit layer 31 , a second circuit layer 32 , a spacer layer 35 , a first adhesive layer 33 and a second adhesive layer 34 .

[0056] The first circuit layer 31 has a plurality of first through holes 311, a plurality of first switches 312, and a first circuit 313 for electrically connecting the first switches 312. The second circuit layer 32 has a plurality of holes corresponding to the first through holes 311. A plurality of second through holes 321, a plurality of second switches 322 corresponding to the first switches 312, and a second line 323 for electrically connecting the second switches 322, and the second circuit layer 32 is characterized by its second The switch 322 and the first switch 312 are arranged in a facing manner, that is, the second switch 322 is arranged on the surface facing the first circuit layer 31, and the first switch 312 is a...

no. 2 example

[0065] The second embodiment of the flexible circuit board 40 of the present invention is shown in Figures 4a and 4b, including: a first circuit layer 41, a second circuit layer 42, a spacer layer 45, a first adhesive layer 43 and a second adhesive layer 44; Several first through holes 411, several first switches 412, and several first lines 413 for electrically connecting the first switches are provided on the first circuit layer 41, and several first circuits 413 are provided on the second circuit layer 42. Two through holes 421, a plurality of second switches 422 and a plurality of second circuits 423 for electrically connecting the second switches, and a plurality of third through holes 451 and a plurality of fourth through holes 452 are arranged on the spacer layer 45 ; The composition of the above-mentioned elements is substantially the same as that of the first embodiment, and its description is omitted here.

[0066] The difference between this embodiment and the first...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A kind of flexible circuit panel includes: the first circuit layer, the second circuit layer, the first adherence layer, the second adherence layer and separating layer. The first circuit layer has a few the first through-holes and a few the second switches which correspond to the first switches, the first switches is set to face to face the second switches, the first adherence layer is set on the first circuit layer by rounding the first through-holes and the first switches; the second adherence layer is set on the second circuit layer by rounding the second through-holes and the second switches; separating layer is set between first circuit layer and second circuit layer and has a few the third through-holes which correspond to the first through-holes and second through-holes and a few the forth through-holes which correspond to the first switches and the second switches.

Description

[0001] Technical content: [0002] The invention relates to a flexible circuit board, in particular to a flexible circuit board which can maintain waterproofness and moderate sensitivity between switches. Background technique [0003] Flexible circuit boards are widely used in many occasions that require lightweight or space constraints, and there are many restrictive specifications that need to be met depending on the application occasions. Among them, whether the waterproof performance is excellent or not, in many occasions, It is a basic requirement for flexible circuit boards. [0004] The traditional waterproof methods of flexible circuit boards can be roughly divided into two categories: two-layer type and three-layer type, wherein the two-layer type flexible circuit board 10 such as Figure 1a As shown, it includes: a first circuit layer 11 , a second circuit layer 12 , a first adhesive layer 13 and a second adhesive layer 14 . [0005] The first circuit layer 11 has a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00
Inventor 江治湘
Owner DARFON ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap