Circuit apparatus mfg. method

Abstract

A method of manufacturing a System In Package (SIP) or Integrated System in Board (ISB) circuit device in which a plurality of circuit elements are covered with and integrally supported by an insulating resin. A user terminal is connected with an ISB server and an ISB mounting factory through a communication network. Specifications to be satisfied by an ISB circuit device desired by a user, such as an external size and terminal information of the ISB and circuit diagram CAD data, for example, are input through the user terminal and transmitted to the ISB server. The ISB server in turn transmits information concerning the due date and cost of the ISB circuit device and also a reliability evaluation result to the user terminal. The ISB server also generates mask data for manufacturing the ISB circuit device based on the input specifications, and transmits the mask data to the ISB mounting factory. The ISB mounting factory, receiving the manufacturing data from the ISB server, manufactures the ISB circuit device and provides the ISB circuit device to the user.

Description

technical field [0001] The present invention relates to a method of manufacturing a circuit device, and more particularly to a method of manufacturing a circuit device in which a circuit element without a support substrate is covered and supported by an insulating resin. Background technique [0002] In recent years, instead of packaging one semiconductor element, a technology has been developed to provide multiple circuit elements such as IC, LSI, and chip resistors as a package as a system, called SIP (System in Package) or ISB (Integrated System in Board ). Among the technologies that provide the system as a package, they are roughly divided into PCB mounting, system LSI, and ISB. It is difficult to achieve small size, light weight, and high performance for PCB mounting, but system LSI can achieve small size, light weight, high performance, and low power consumption. However, it is difficult to change the specifications, and there is a problem that a large amount of cost...

AI Technical Summary

Problems solved by technology

Among the technologies that provide the system as a package, they are roughly divided into PCB mounting, system LSI, and ISB. It is difficult to achieve small size, light weight, and high performance for PCB mounting, but system LSI can achieve small size, light weight, high performance, and low power consumption. However, it is difficult to change the specifications, and there is a problem that a large amount of cost is required to develop new specifications

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