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Optoelectronic component

A technology for optoelectronic components and optoelectronic semiconductors, which can be applied to electrical components, electrical solid state devices, circuits, etc., and can solve problems such as low luminous efficiency.

Inactive Publication Date: 2005-02-09
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Certainly, when using semiconductor chips emitting radiation from the blue spectral region and / or the ultraviolet spectral region, especially when using GaN semiconductor chips, wherein the radiation-emitting active region has GaN, InGaN, AlGaN or InAlGaN material, The luminous efficiency of the element is undesirably low

Method used

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  • Optoelectronic component
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Embodiment Construction

[0023] exist figure 1 A cross-section of a photovoltaic element perpendicular to the mounting surface 7 of the housing is schematically shown in FIG. 2 , on which the invention can be used. The case 2 is formed by surrounding injection molding of the lead frame 1 at the same time as the case 2 is formed. The housing 2 preferably has a central recess 6 facing the housing. A semiconductor chip 3 such as a photoelectric transmitter or receiver, preferably a light-emitting diode core based on GaN, InGaN, AlGaN and / or InGaAlN semiconductor material, is accommodated in this recess. The electrical contact surfaces of the chip 3 are connected to the electrical contacts 1A, 1B of the lead frame 1 by means of bonding wires or, for example, by means of electrically conductive connection means, and are thus electrically conductively connected to the chip wires.

[0024] The inner surface 2A of the recess 6 of the housing 2 is formed obliquely so that it deflects the radiation emanating...

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Abstract

Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

Description

technical field [0001] The invention relates to a photovoltaic element according to the preamble of claim 1, in particular a light-emitting element which can preferably be surface-mounted. Background technique [0002] In this context, the term "encapsulation material" especially includes any material which can be brought into a predetermined shape by casting, spraying, injection molding or die casting. In particular reactive resins such as epoxies, acrylics and silicones are such materials. It is also conceivable to use ceramic or glass-like materials. [0003] In the case of conventional surface-mounted optoelectronic component materials, a prepackaged component is first produced by injecting a suitable plastic around a prefabricated chip lead frame, which plastic forms the housing of the component. The housing has, for example, a recess on the upper surface, into which the lead contacts are inserted from opposite sides. A semiconductor chip, for example an LED chip, is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60
CPCH01L33/486H01L33/60H01L33/483H01L2224/48091H01L2224/48247H01L2924/00014
Inventor G·博纳H·布伦纳G·克劳特G·韦特尔
Owner OSRAM OPTO SEMICON GMBH & CO OHG