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Fluid jet device and manufacturing method

A technology of fluid jetting and manufacturing method, applied in the direction of printing, etc., can solve the problems of inkjet offset, inability to be in an ideal state, affecting printing quality, etc.

Inactive Publication Date: 2006-07-05
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the actual operation situation is not as ideal, please refer to Figure 3A and Figure 3B description, such as Figure 3A As shown, due to the special geometric configuration of the end 34 of the fluid chamber, the ink cannot be filled to the end 34 of the fluid chamber smoothly during the process of filling the fluid chamber 32, and so-called residual bubbles 36 are generated. If the residual bubbles 36 are not added Elimination will seriously affect the generation of double bubbles, resulting in the generation of two bubbles 38 and 40 with different shapes, and then applying different degrees of squeezing force to the ink, causing the ink droplet 42 to finally eject out of the nozzle hole 44 in an unoriented direction, such as Figure 3B shown
[0007] Since the printing quality is good or not, it depends on the accuracy of the ink drop on the paper. If the speed and direction of the ink drop leaving the ejection device 3 cannot be fixed, the ink drop will be different due to the initial velocity and the ejection angle during the flight. The difference in α makes the flying distance of each ink droplet different (such as 1 or 1'), resulting in an indeterminate offset d when reaching the paper 2, which seriously affects the printing quality, such as Figure 4 As shown, and the biggest factor causing inkjet misalignment mentioned above is the residual air bubbles accumulated in the fluid chamber

Method used

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  • Fluid jet device and manufacturing method
  • Fluid jet device and manufacturing method
  • Fluid jet device and manufacturing method

Examples

Experimental program
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Embodiment 1

[0066] See Figure 5A versus Figure 5D , Describe the structural features of the fluid ejection device of this embodiment. among them Figure 5D for Figure 5A Figure is a cross-sectional view taken along 5D-5D. Such as Figure 5D As shown, the fluid ejection device has an opening 66 formed at the end 68 of the fluid cavity 54. The opening 66 passes through the structural layer 56 and communicates with the end 68 of the fluid cavity through the pressure relief hole 64. The equivalent radius of the pressure relief hole 64 is It is smaller than the nozzle 62. Next as Figure 5A As shown, in this embodiment, since a silicon substrate with a lattice arrangement direction of [110] is selected as the substrate (the present invention is not limited to this), the end of the etched fluid cavity presents a pyramid shape, and the opening 66 is a rectangle , And the pressure relief hole 64 is a triangle.

[0067] See next Figure 5D To illustrate the detailed structure of the fluid ejection ...

Embodiment 2

[0079] See Figure 6 versus Figure 5D Describe the structural features of the fluid ejection device of this embodiment, where Figure 5D for Figure 6 The section view taken along 5D-5D, such as Figure 5D As shown, the fluid ejection device has an opening 66 formed at the end 68 of the fluid cavity 54. The opening 66 passes through the structural layer 56 and communicates with the end 68 of the fluid cavity through the pressure relief hole 64. The equivalent radius of the pressure relief hole 64 is Smaller than the nozzle hole 62, then Figure 6 As shown, since the substrate 50 of this embodiment uses a silicon substrate with a lattice arrangement direction of [100], the end of the etched fluid cavity is rectangular, the opening 66 is a pyramid shape, and the pressure relief hole 64 is a triangle. The difference between this embodiment and Embodiment 1 is that Embodiment 1 uses a silicon substrate with a lattice arrangement direction of [110], while this embodiment uses a silico...

Embodiment 3

[0082] See Figure 7A versus Figure 7D Describe the structural features of the fluid ejection device of this embodiment, where Figure 7D for Figure 7A The section view taken along 7D-7D, such as Figure 7D As shown, the fluid ejection device has a diversion channel 84 formed on at least one side of the space of the fluid cavity 82, and the diversion channel 84 is formed by a diversion protrusion 86' that extends into the fluid cavity 82 and is separated from the fluid cavity 82. , Wherein the width of the guide channel 84 is less than half of the width of the fluid cavity 82.

[0083] See next Figure 7D To illustrate the detailed structure of the fluid ejection device of this embodiment, the fluid ejection device includes a substrate 80, a fluid cavity 82, a flow channel 84, a structure layer 86, a flow guide bump 86', a protective layer 88 and a nozzle hole 90.

[0084] The structural layer 86 covers the base 80 and the fluid cavity 82, the diversion bump 86' is the part of t...

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Abstract

The present invention provides a fluid jetting equipment, including; a base; a fluid cavity formed in said base; a structure layer for covering said base and said fluid cavity; at least a jet orifice which is passed through said structure layer and communicated with said fluid cavity; an opening which is passed through said structure layer and communicated with tail end of said fluid cavity, and a pressure-releasing hole formed in the communicated placed of said structure layer and said fluid cavity. Besides, said invention also provides a method for making said fluid jetting equipment.

Description

Technical field [0001] The invention relates to a fluid ejection device, in particular to a fluid ejection device capable of removing residual bubbles in a fluid cavity and a manufacturing method thereof. Background technique [0002] In various inkjet printing applications, the improvement of print quality has always been a goal pursued by all users and manufacturers, and there are many factors that affect print quality, among which the stability of jetting ink drops is a very important part. [0003] Take the thermal inkjet printer as an example. The bubble generated by the resistance heating element is mainly used to squeeze the ink to eject the ink from the nozzle hole onto the recording medium to complete the inkjet process. Therefore, the size of the bubble generated in the process is Whether there is the accumulation of residual bubbles in the fluid cavity, etc. become an important factor affecting the stability of the ink jet. [0004] The basic structure of the heating f...

Claims

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Application Information

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IPC IPC(8): B41J2/14B41J2/16B41J2/01
Inventor 马国栋李英尧胡宏盛
Owner BENQ CORP