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Flow controller and its regulation method

A flow control device and flow control technology, applied in the direction of measuring device, fluid pressure control, non-electric variable control, etc., can solve the problem of different real flow

Active Publication Date: 2006-09-27
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in such a mass flow control device 2, the flow rate (hereinafter also referred to as "real flow rate") that actually flows through the flow control valve 20 needs to be different from the mass flow rate indicated by the flow rate setting signal (hereinafter referred to as "real flow rate"). Flow rate") is consistent with high precision, but when the supply air pressure has changed or the device itself has changed over time, even if the same pulse drive voltage as the device was delivered is applied, the actual flow rate of the gas that flows may sometimes also slightly different

Method used

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  • Flow controller and its regulation method

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no. 1 Embodiment

[0075] figure 1 It is a block diagram showing the first embodiment of the related mass flow control device of the present invention. figure 2 It is an arrangement diagram showing the actual arrangement state of each component in the first embodiment. Also, give Figure 17 as well as Figure 18 Components that are the same as those shown in , are denoted by the same symbols, and descriptions thereof are omitted.

[0076] As shown in the figure, the mass flow control device 40 is interposed in the middle of a fluid channel through which fluid such as liquid or gas flows, such as the gas pipe 4, and controls its mass flow rate (hereinafter also referred to as "flow rate"). In addition, the inside of the semiconductor manufacturing apparatus connected to one end of the gas tube 4 is evacuated, for example. This mass flow control device 40 has a mass flow control main body 40A and a detection main body 40B that detects a mass flow rate, which is a feature of the present invent...

no. 2 Embodiment

[0138] Next, a second embodiment of the related mass flow control device of the present invention will be described.

[0139] In this second embodiment, the function of enabling high-accuracy zero-point adjustment is provided, and at the same time, the size and compactness of the device itself can be realized.

[0140] In this kind of mass flow control device, although the zero point of the flow detection is only slightly changed due to time-dependent changes, the deviation is unavoidable. Therefore, the zero point adjustment is carried out regularly or irregularly. However, in order to improve the accuracy of the zero point adjustment, it is best It is best to completely stop the flow of fluid (including gas and liquid) inside the device. In this case, even if the flow control valve 20 using a diaphragm is in the valve-closed state, it is difficult to completely cut off the flow of the fluid due to its characteristics. Although it is only a little bit, an extremely small amou...

no. 3 Embodiment

[0163] Figure 13 It is a block diagram showing a third embodiment of the related mass flow control device of the present invention. The mass flow control device 401 of the third embodiment differs from the mass flow control device 40 of the first embodiment in that the detection execution unit 401B is located downstream of the mass flow control unit 401A in the flow path 6 . In addition, the detection execution part 401B of the mass flow control device 401 of the third embodiment is different from the mass flow control of the first embodiment in that the detection valve part 42 is provided downstream of the detection container part 44 and the pressure detection mechanism 46. The detection execution unit 40B of the device 40 is different. Other aspects of the configuration of the mass flow control device 401 of the third embodiment are the same as those of the mass flow control device 40 of the first embodiment.

[0164] In the third embodiment, first, the mass flow control ...

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Abstract

A mass flow controller arranged to perform mass flow test operation in the controller itself by incorporating a test tank. The mass flow controller is provided, in a channel (6) for feeding fluid, with a means (8) for detecting the mass flow rate of fluid flowing through the channel and outputting a flow rate signal, and a mechanism (10) for controlling the mass flow rate by varying the valve opening by a valve drive signal, and comprises a means (18) for controlling the flow rate control valve mechanism based on an external flow rate setting signal and the flow rate signal. The flow channel is provided with a test valve section (42) for opening / closing the channel, a test tank section (44) having a specified capacity, and a means (46) for detecting the fluid pressure and outputting a pressure detection signal. A test control means (48) controls mass flow rate test operation to be carried out using the test valve, the test tank section and the pressure detecting means.

Description

technical field [0001] The invention relates to a flow control device for measuring the flow of a fluid with a relatively small flow such as gas, in particular to a flow control device capable of performing a flow control accuracy test and an adjustment method thereof. Background technique [0002] In general, in order to manufacture semiconductor products such as semiconductor integrated circuits, for example, CVD film formation or etching operations are repeatedly performed on semiconductor wafers (wafers) in various semiconductor manufacturing equipment. The supply amount of the processing gas is controlled with high precision, so mass flow control devices such as mass flow controllers (for example, JP-A-6-119059, JP-A-7-078296, JP-A-7-134052, etc.) are used. Publication No. 7-281760, JP-7-306084, JP-11-223538, JP-2004-20306, US Patent No. 6450200, JP-8-185229, Japanese Patent Laid-Open Publication No. 11-154022). [0003] Here, compare Figure 17 as well as Figure 18...

Claims

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Application Information

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IPC IPC(8): G05D16/00G01F25/00
Inventor 田中诚铃木茂洋
Owner HITACHI METALS LTD
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