Polyurethane rigid foam with low density and low thermal conductivity

Abstract

the invention discloses a low-density low-conductive polyurethane rigid foam, which comprises the following parts: (a) 30-60 wt% polyether, which adopts sucrose as initiator to addition with oxidizedolefin; 10-30wt% polyether, which adopts toluenediamine as initiator to addition with oxidized olefin; 20-50wt% polyether, which adopts pentaerythrite and methylglucoside as initiator to addition withoxidized olefin; 5-20wt% polyether, which adopts glycerin as initiator to addition with oxidized olefin; (b) 1.5-3.5 wt% compound catalyst; (c) 7-17wt% foamer; (d) 1.5-2.8wt% water; (e) 1.4-4.0wt% foam stabilizer; (f) polyisocyanates, which adopts compound as datum polyether and water with index at 0.95- 1.50.

Description

technical field [0001] The invention relates to a polymer material, in particular to a closed-cell polyurethane rigid polyurethane foam with low density and low thermal conductivity mainly used as a thermal insulation layer of refrigerators and freezers. Background technique [0002] Rigid polyurethane foam is prepared by the interaction of -OH and -NCO in the presence and action of catalysts, foaming agents, and foam stabilizers. It has the lowest thermal conductivity and the best thermal insulation performance among all thermal insulation materials, so it is widely used in the thermal insulation layer of refrigerators, freezers, cold storage panels, sandwich panels, pipe insulation, refrigerated containers, etc. However, with the prohibition of the use of Freon and the restriction of the use of HCFC-141b, pentane is generally used for foaming in the field of refrigerators and freezers in the world. [0003] The thermal conductivity of rigid polyurethane foam depends to a ...

AI Technical Summary

Problems solved by technology

[0004] Although the existing technology can reduce the density of the product, the problem is that it directly affects the dimensional stability of the product, that is, the appearance of the product; at the same time, it also has a certain negative impact on the thermal conductivity of the foam.