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Board unloading device and board unloading method

A technology of unloading device and dismantling device, which is applied in the direction of electrical components, electrolysis process, semiconductor/solid device manufacturing, etc., and can solve problems such as bending of the upper end

Active Publication Date: 2007-05-09
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, in the case of a thin substrate W with a thickness of 0.1 mm or less, the substrate W sticks to the receiving table 53 during the fall due to the surface tension of the above-mentioned processing liquid, and the upper end portion that is not caught by the receiving table 53 may become loose. Defects such as bending

Method used

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  • Board unloading device and board unloading method
  • Board unloading device and board unloading method
  • Board unloading device and board unloading method

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Experimental program
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Embodiment Construction

[0077] 1. Structure of substrate unloading device

[0078] Fig. 1 is a diagram showing the structure of a substrate unloading device (unloader 5a) of the present invention. Moreover, the unloader 5a shown in FIG. 1 is installed in the position of the unloading part 5 of the surface treatment apparatus 100 shown in FIG. 7, as mentioned later.

[0079] The unloader 5a shown in FIG. 1 is a device for unloading the substrate W from the transport hanger 15 holding the substrate W. An unloading operation of the loaded (stacked) substrate W is performed.

[0080] As shown in FIG. 1, the unloader 5a has: a substrate removal device, which is composed of a hanger support device 51 arranged on a base frame 70, a clamp opening device 50 and a substrate shedding device 58 arranged on a base frame 72; and The substrate storage device is composed of a substrate receiver 52 (partial cutout), a rotation device 54 and a substrate transfer device 56 . The above-mentioned substrate removal dev...

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Abstract

Provides a device that can simplify unloading task and can be easily to unload and pile even if the thickness of the board is thin. The board dropper 50 unlocks clamping of the board W in fallen condition of the transport hanger 15. The board container 52 receives and houses the board W when the board W has fallen vertically. By activating the rotate cylinder 54 a, the board container 52 is rotated. The transport roller 56 carries out the board horizontally from an open area 52 a of the rotated board container 52.

Description

[0001] The scope of the claims of Japanese Patent Application No. 2005-300255 and Japanese Patent Application No. 2006-254759, description, drawings, and abstract are incorporated into this application. technical field [0002] The present invention relates to a technique for unloading a substrate from a transport hanger used in a surface treatment apparatus such as a plating apparatus and conveying the substrate. Background technique [0003] First, the configuration of a surface treatment apparatus having a substrate unloading device (unloader) will be described below using FIGS. 7 and 8 . FIG. 7 is a plan view of the surface treatment device 100 viewed from above. FIG. 8 is a side view of the surface treatment apparatus 100 shown in FIG. 7 viewed from the α direction. [0004] As shown in Figures 7 and 8, the surface treatment device 100 is a so-called push-type electroplating device, which has: a transport hanger 15 that holds substrates such as printed circuit boards; ...

Claims

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Application Information

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IPC IPC(8): H01L21/67C25D17/00
Inventor 佐生晴司大村泰基
Owner C UYEMURA & CO LTD