Method and device for synthesizing heat-conductive glue

Abstract

There's provided a way to synthesize heat conductible glue which includes the following steps: providing filled powder and heat conductible glue base material; putting the mentioned filled powder and base material into one mixing device with strong shearing force, zooming the filled powder by shearing force while keeping the base material in melting state or liquid; cooling the mentioned mixture to get the heat conductible glue. The method in the invention pulverizes the powder aggregate by shearing force while releases the gas contained in the aggregate, so that the base material and filled powder can mix quickly, uniformly and efficiently. There's also provided a device to synthesize the heat conductible glue.

Description

【Technical field】 [0001] The invention relates to the field of heat transfer, in particular to a method and device for synthesizing heat-conducting glue. 【Background technique】 [0002] As integrated circuits become more dense and miniaturized, electronic components become smaller and operate at higher speeds, making their heat dissipation requirements increasingly demanding. Therefore, in order to dissipate the heat from the heat source as soon as possible, it has become a common practice in the industry to install a heat sink on the surface of the electronic component. It utilizes the high thermal conductivity of the material of the heat sink to quickly dissipate the heat to the outside. However, the surface of the heat sink and the heat source There is often a certain gap in the contact, so that the heat sink and the surface of the heat source are not in close contact, which becomes a major defect in the heat dissipation of the heat sink. Aiming at the problem of contact...

AI Technical Summary

Problems solved by technology

However, when the filler powder content in the thermal conductive adhesive increases to a certain extent, it is difficult to further improve the thermal conductivity of the thermal conductive adhesive with the increase of the filler powder content.

This is because when the filling powder content is high, the filling powder particles are more and more likely to agglomerate and form aggregates. When using the existing technology to mix, it takes a long time and the efficiency is low, and it is difficult to evenly disperse the aggregates of the filling powder , making it difficult to further improve the thermal conductivity of the thermally conductive adhesive

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