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Channel connection for pipe to block joints

a technology of channel connection and pipe block, which is applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of less than optimal heat transfer, less than desirable coupling region, and half-open design

Inactive Publication Date: 2001-12-13
AAVID THERMALLOY LLV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the heat pipe 105 is inserted afterwards, it displaces some of the adhesive material 103 and results in a less than desirable coupling region.
This results in a "half-open" design.
A drawback to this approach is that a significant amount of pipe surface area 208 is not in contact with the heat plate, thus resulting in a less than optimal heat transfer.
There are several problems with this solution.
First, extra manufacturing and assembling steps are required to create and bend the extension tabs.
Second, the edges of the extension tabs are pressed against the side of the heat pipe, and might rupture the sides of the heat pipe.
Third, the large volume of filler material placed on both sides of the heat pipe is inefficient and wasteful.

Method used

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  • Channel connection for pipe to block joints
  • Channel connection for pipe to block joints
  • Channel connection for pipe to block joints

Examples

Experimental program
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Effect test

Embodiment Construction

[0021] The presently preferred embodiment of the present invention consists of a heat conductive material block (or heat plate) 410 having a drilled or milled tunnel or channel 401 that has a transverse slot 450 formed in the surface of the heat plate above the channel 401. The channel 401 and / or slot 450 can be formed via a molding process, via drilling techniques, or other machinery techniques as are well-known in the art. The diameter of the channel is larger than the width of the transverse slot 450 and is sized to accept a heat pipe 405 while providing additional space for allowing application of a thermally conductive adhesive material 403 to the channel walls to bond the heat pipe 405 to the channel walls of the heat plate 410, as discussed more fully below.

[0022] A thermally conductive adhesive or bonding agent 403 is used to thermally couple the heat pipe 405 with the channel 401. This is accomplished by applying the adhesive or bonding agent 403 through the slot 450 into a...

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PUM

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Abstract

A heat sink assembly having a heat plate with a channel formed therein which is accessible through a surface of the heat plate via a slot. A heat pipe is disposed in the channel and is bound to the heat plate with a bonding material disposed through the slot and into the channel.

Description

[0001] This application claims priority from U.S. Provisional patent application Ser. No. 60 / 202,011 which was filed on May 04, 2000.[0002] 1.Field of the Invention[0003] The present invention relates to heat dissipation devices and more particularly to the connection of such devices to a thermal source.[0004] 2.Description of the Related Art[0005] Heat sinks are widely used devices that dissipate, or in some case, absorb, heat from objects that need to remain cool, such as machinery or computer equipment. One type of heat sink comprises a block of heat conductive material, or evaporative plate, with a tunnel or bore machined through it. A heat dissipating pipe is inserted through this tunnel in order to absorb and dissipate the heat conducted to it through the heat conducting material of the surrounding heat plate. The heat plate is attached to the object that requires cooling, such as, for example, a wall of a computer cabinet or the mounting of an IC in a laptop computer. An exam...

Claims

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Application Information

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IPC IPC(8): F28D15/02H01L23/427
CPCF28D15/02H01L23/427H01L2924/0002H01L2924/00
Inventor CHEUNG, CHE M.MOORE, MARVIN F.PROSPERI, ROBERTO
Owner AAVID THERMALLOY LLV