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Electronic device with improved cooling mechanism

a technology of electronic devices and cooling mechanisms, applied in the direction of semiconductor devices, lighting and heating apparatus, basic electric elements, etc., can solve the problems of affecting the size of electronic devices, increasing power consumption as well as heat generation, and affecting the efficiency of electronic devices

Inactive Publication Date: 2006-11-09
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The continuously improved calculation capability of microprocessors result in more and more power consumption as well as heat generation.
However, smaller dimension of electronic devices what people expect nowadays impedes heat dissipation.
It is unavoidable that the sizes of components in the electronic device are generally manufactured with a varied tolerance.
The varied tolerance generally means leads that the cooling plate, the cooling pad and the chip cannot contact closely, which reduces the heat dissipation efficiency. FIG. 1A and FIG. 1B show two typical situations regarding size tolerance of components.
The gap D decreases the heat dissipation capability and even results in damage to components.
Furthermore, heat dissipation problem becomes more serious when there are multiple chips disposed on the substrate 102, as shown in FIG. 1C.
While the dimension of electronic devices becomes smaller and smaller, the heat dissipation issue due to size tolerance of components and substrate distortion becomes more important.

Method used

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  • Electronic device with improved cooling mechanism
  • Electronic device with improved cooling mechanism
  • Electronic device with improved cooling mechanism

Examples

Experimental program
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Effect test

first embodiment

[0018]FIG. 2 illustrates an electronic device 200 in accordance with the present invention, such as optical drive, projector, etc. In this embodiment, the electronic device is a projector, including a substrate 220, a processor 240, and a cooling mechanism 260. It should be noted that the attached drawings are provided for descriptive purpose and are not drawn to actual size or scale. In order to clearly illustrate the features of the present invention, the figures also neglect some typical components in the electronic device 200. Those who are skilled in the art understand the electronic device 200 may include other components, such as power source, lamp, fan, and so on.

[0019] The processor 240 is disposed on the substrate 220. In this embodiment, the processor 240 is a Very Large Scale Integrated Circuit (VLSI) chip, and the substrate 220 is a Printed Circuit Board (PCB). The cooling mechanism 260 includes a conductive medium 262, a cooling plate 264, and a protrusion 266. The coo...

second embodiment

[0021]FIG. 3 illustrates an electronic device 300 in accordance with the present invention. In this embodiment, the electronic device 300 is an optical drive, including a substrate 320, a processor 340, a cooling mechanism 360 and a fasten device 380. It should be noted that the attached drawings are provided for descriptive purpose and are not drawn to actual size. In order to clearly illustrate the features of the present invention, the figures also neglect some typical components in the electronic device 300. Those who are skilled in the art understand the electronic device 300 may include other components, such as optical pickup head, stepping motor, spindle, tray, and so on.

[0022] The processor 340 is disposed on the substrate 320. In this embodiment, the processor 240 is a Very Large Scale Integrated Circuit (VLSI) chip, and the substrate 320 is a Printed Circuit Board (PCB). The cooling mechanism 360 includes a conductive medium 362, a cooling plate 364, and a protrusion 366....

third embodiment

[0024]FIG. 4 illustrates an electronic device 400 in accordance with the present invention. In this embodiment, the electronic device 400 is an optical drive, including a substrate 420, processor 440 and processor 442, a cooling mechanism 460 and a fasten device 480. The electronic device 400 is different from the electronic device 300 by the implementing multiple processors, i.e. processor 440 and 442. Here two processors are illustrated as an exemplary embodiment, and those who skilled in the art understand that more processors may also be implemented in the present invention. Note that descriptions of some aspects similar to the aforementioned embodiments will be omitted here for conciseness.

[0025] In this embodiment, the cooling mechanism 460 includes conductive medium 462 and 464, respectively touching the processors 440 and 442, and a cooling plate 466 touching the conductive medium 462 and 464. The protrusion 468 protrudes from the cooling plate 466 and connects the substrate...

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PUM

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Abstract

An electronic device includes a substrate, a processor, and a cooling mechanism. The processor is disposed on the substrate. The cooling mechanism includes a conductive medium, a cooling plate and a protrusion. The conductive medium contacts the processor. The cooling plate contacts the conduction medium. The protrusion protruding from the cooling plate connects the substrate to define and maintain a distance between the substrate and the cooling plate. Thus, the contact between the processor, the conductive medium, and the cooling plate are tightly maintained.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority of Taiwan Patent Application Serial No. 094114876 entitled “ELECTRONIC DEVICE,” filed on May 9, 2005. FIELD OF INVENTION [0002] The present invention relates to an electronic device, and particularly to an electronic device with an improved cooling mechanism. BACKGROUND OF THE INVENTION [0003] The continuously improved calculation capability of microprocessors result in more and more power consumption as well as heat generation. However, smaller dimension of electronic devices what people expect nowadays impedes heat dissipation. [0004] In typical electronic devices, the major heat source is the VLSI chip. Therefore, it requires an additional cooling plate connecting to the chip. For some design, a cooling pad or cooling paste is also implemented between the cooling plate and the chip to improve the heat dissipation rate. For space saving concern, the housing of the electronic device is usually implement...

Claims

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Application Information

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IPC IPC(8): F28F7/00F28D15/00
CPCH01L23/367H01L23/4006H01L23/42H01L2023/4062H01L2023/4068H01L2924/0002H05K7/20436H01L2924/00
Inventor CHUANG, CHUNG-PINGTSAI, MING-HSUEHCHUANG, CHENG-CHIEH
Owner BENQ CORP