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Methods and apparatus for multiple temperature levels

Inactive Publication Date: 2008-11-20
RAYTHEON CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0004]Methods and apparatus for thermal management according to various aspects of the present invention comprise a heat exchanger and one or more controllable thermal transfer elements. In one embodiment, the thermal transfer elements c

Problems solved by technology

Compact designs, however, have led to many thermal energy producing elements packed into a tight space.
Heat can be an enemy of electrical components and can decrease efficiency and reliability.

Method used

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  • Methods and apparatus for multiple temperature levels
  • Methods and apparatus for multiple temperature levels
  • Methods and apparatus for multiple temperature levels

Examples

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Embodiment Construction

[0010]The descriptions are of exemplary embodiments of the invention and the inventors' conception of the best mode and are not intended to limit the scope, applicability or configuration of the invention in any way. Rather, the following description is intended to provide convenient illustrations for implementing various embodiments of the invention. Changes may be made in the function and / or arrangement of any of the elements described in the disclosed exemplary embodiments without departing from the spirit and scope of the invention.

[0011]Various representative implementations of the present invention may be applied to any system for thermal energy transfer. The present invention may be described in terms of conventional plates, heat transfer media, and fluids. Plates in accordance with the present invention may comprise any number of conventional materials including, but not limited to, ceramics, metals, plastics, fiberglass, glass, various other inorganic and organic materials ...

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Abstract

Methods and apparatus for thermal management according to various aspects of the present invention comprise a heat exchanger and one or more controllable thermal transfer elements. In one embodiment, the thermal transfer elements comprise thermoelectric coolers. The thermal transfer elements are thermally coupled to the heat exchanger. Components on a surface near the thermal transfer elements may be selectively cooled by controlling the thermal transfer elements.

Description

BACKGROUND OF THE INVENTION[0001]Electrical component manufacturers strive to shrink their designs and pack more technology into a compact footprint. Advances in materials and fabrication processes have lead to much progress in this area. Compact designs, however, have led to many thermal energy producing elements packed into a tight space. Heat can be an enemy of electrical components and can decrease efficiency and reliability.[0002]A heat sink absorbs and dissipates heat using thermal contact. Heat sinks are widely used in electronics, and have become almost essential to modern central processing units. In common use, a heat sink is a metal object brought into contact with an electronic component's hot surface. Microprocessors and power handling semiconductors are examples of electronics that use a heat sink to reduce their temperature through increased thermal mass and heat dissipation.[0003]Cold plates may also be used as heat sinks. In a world of compact designs with increasin...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCF28D2021/0029F28F13/00H01L23/38H01L23/427H01L2924/09701H01L2924/0002F28F2013/005H01L2924/00
Inventor WYATT, WILLIAM G.PRUETT, JAMES A.
Owner RAYTHEON CO
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