Vapor chamber and supporting structure thereof
Patent Information
- Authority / Receiving Office
- US ยท United States
- Current Assignee / Owner
- CELSIA TECH TAIWAN INC
- Publication Date
- 2009-08-06
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to a supporting structure, in particular, to a supporting structure for vapor chamber and a vapor chamber.
[0003] 2. Description of Prior Art
[0004] Following continuous promotion in computing speed, more and more heat is generated in a computer's CPU. Thus, a cooling device comprised of aluminum-extruding cooler and fan has already been unable to satisfy the using requirement of current CPU. So, some relative industries subsequently develop heat pipe and vapor chamber, both of which have a higher heat-transferring performance. A cooler integrated with heat pipe or vapor chamber can effectively solve the cooling problem currently existed. Besides, since a vapor chamber is directly attached to heating electronic element with large contacting area, it attracts many relative industries to devote more efforts into the R&D work of this kind of vapor chamber.
[0005] As shown in FIG. 1, accord...