Thermal management of electronic devices

Abstract

Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.

Description

FIELD OF THE INVENTION[0001]Implementations consistent with the principles of the invention relate generally to heat dissipation and, more particularly, to systems and methods of heat transfer through a substrate supporting electronic components to control operating temperatures of the electronic components.BACKGROUND OF THE INVENTION[0002]Physical compactness of electronic devices, such as interface devices mounted at a user interface edge of an electronic assembly, impedes cooling of the electronic devices, which is a particular concern for electronic devices that consume a substantial amount of power, and thus generate a significant amount of heat. For example, when transceivers, such as small form-factor pluggable (SFP) modules, are ganged into multiple cages, the transceivers in the middle of the cluster may generate and retain an undesirable amount of heat. Very little airflow may reach individual modules in certain positions of the cluster for cooling purposes. Unlike stand-a...

AI Technical Summary

Benefits of technology

[0001]Implementations consistent with the principles of the invention relate generally to heat dissipation and, more particularly, to systems and methods of heat transfer through a substrate supporting electronic components to control operating temperatures of the electronic components.

Problems solved by technology

Physical compactness of electronic devices, such as interface devices mounted at a user interface edge of an electronic assembly, impedes cooling of the electronic devices, which is a particular concern for electronic devices that consume a substantial amount of power, and thus generate a significant amount of heat.

For example, when transceivers, such as small form-factor pluggable (SFP) modules, are ganged into multiple cages, the transceivers in the middle of the cluster may generate and retain an undesirable amount of heat.

Unlike stand-alone devices, which have relatively large surface areas that may radiate heat, clustered devices may have only limited surface area from which to radiate heat.

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