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Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method

a technology of holding apparatus and retainer ring, which is applied in the direction of work carriers, etc., can solve the problems of rounded inner and outer peripheral surfaces, friction force on the wafer, etc., and achieve the effect of higher toughness of the upper ring

Inactive Publication Date: 2016-08-25
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]According to another embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged outside the inside ring, the outsid

Problems solved by technology

While polishing the wafer is underway, the surface of the wafer comes into sliding contact with the polishing pad, causing a friction force on the

Method used

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  • Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method
  • Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method
  • Retainer ring, substrate holding apparatus, and polishing apparatus, and retainer ring maintenance method

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Embodiment Construction

[0035]A detailed description will hereinafter be given with reference to the drawings.

[0036]According to one embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring, wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm.

[0037]Since the outside ring is highly abrasion-resistant, and an appropriate distance is set between an inner peripheral surface of the inside ring and a convex portion, it is possible to maintain a load acting point of the retainer ring near an edge of the substrate, stabilizing a polishing rate.

[0038]According to another embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged ...

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PUM

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Abstract

According to one embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring, wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Japanese Priority Patent Application JP 2015-33668 filed on Feb. 24, 2015, the entire contents of which are incorporated herein by reference.FIELD[0002]The present technology relates to substrate holding apparatuses that hold substrates, such as wafers, and in particular, relates to a substrate holding apparatus used for polishing a surface of a substrate by pressing the substrate onto a polishing tool, such as a polishing pad. The present technology further relates to a polishing apparatus that uses such a substrate holding apparatus. The present technology still further relates to a retainer ring used in the above described substrate holding apparatus.BACKGROUND AND SUMMARY[0003]A polishing apparatus for polishing a surface of a wafer is widely used in a process for manufacturing semiconductor devices. Such a kind of the polishing apparatus includes a polishing table supporting a polishing pad havi...

Claims

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Application Information

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IPC IPC(8): B24B37/32
CPCB24B37/32
Inventor FUKUSHIMA, MAKOTOYASUDA, HOZUMINAMIKI, KEISUKE
Owner EBARA CORP