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Three-dimensional integrated circuit systems in a package and methods therefor

a technology of integrated circuits and packages, applied in the field of stacked integrated circuit systems in packages, can solve the problems of long process cycle of three-dimensional ic sip packaging technologies, increased cost, and reliability problems,

Active Publication Date: 2017-02-23
NXP USA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Three-dimensional IC SiP packaging technologies usually have lengthy process.
The complex processes required to form SiPs can present manufacturing challenges, increased cost, and reliability issues.

Method used

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  • Three-dimensional integrated circuit systems in a package and methods therefor
  • Three-dimensional integrated circuit systems in a package and methods therefor
  • Three-dimensional integrated circuit systems in a package and methods therefor

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Embodiment Construction

[0010]Embodiments of systems and methods disclosed herein include embedding die and other components in cavities in a prefabricated substrate. Vias are formed through the substrate to allow components to be connected on either side of the substrate. The “bottom side” of the substrate has routing layers which can act as a “metal 0” layer in the package. The “top side” of the substrate has solder mask openings to receive one or more packages or surface mount devices. The components to be placed in the cavities can have different thicknesses, which would ordinarily complicate manufacturing due to the resulting uneven surface. To solve this problem, the variation in thickness is compensated by using epoxy to hold the die and components in the cavity and create an even surface at the top surface of the substrate by embedding the components at different depths in the cavities. A relatively high viscosity epoxy can be used to make sure the die and component stay in the place after placemen...

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PUM

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Abstract

A method for making a packaged semiconductor device includes dispensing a first adhesive into a first cavity of a substrate having a first major surface and a second major surface. The first cavity extends into the substrate from the second major surface. The method further includes placing a first component having a thickness less than a thickness of the substrate into the first cavity such that the first adhesive physically contacts a first major surface of the first component and at least partially fills a gap between sidewalls of the first component and sidewalls of the first cavity. After placing the first component, a second major surface of the first component is coplanar with the second major surface of the substrate.

Description

BACKGROUND[0001]Field[0002]This disclosure relates generally to semiconductor devices, and more specifically, to stacked integrated circuit systems in a package, and methods therefor.[0003]Related Art[0004]Three-dimensional integrated circuit (ICs) systems in package (SiP) may comprise a number of package layers stacked one upon another with inter-package connection comprising through-vias. Three-dimensional IC SiP packaging technologies usually have lengthy process. For example, a three-dimensional fan-out wafer level package requires panels containing one or more components to be joined together, through-package vias to be formed, and build-up layers to be formed. In addition, components on different layers of the package can have different heights or thicknesses. The complex processes required to form SiPs can present manufacturing challenges, increased cost, and reliability issues. It is therefore desirable to develop three-dimensional packaging technology with reduced process c...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L23/49894H01L23/49816H01L21/486H01L21/4853H01L23/49827H01L21/568H01L24/19H01L24/20H01L24/97H01L25/105H01L2224/04105H01L2224/12105H01L2225/1035H01L2225/1041H01L2225/1058H01L2924/19105
Inventor GONG, ZHIWEIHAYES, SCOTT M.VINCENT, MICHAEL B.
Owner NXP USA INC