Electronic component mounting system and electronic component mounting method
a technology for electronic components and mounting systems, applied in the direction of electrical components, electrical apparatus, etc., can solve the problems of material defects and possible deterioration of mounting boards, and achieve the effect of managing the quality of mounting boards
Active Publication Date: 2017-04-06
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Benefits of technology
The patent text explains how to manage the quality of a mounting board used for mounting electronic components. The goal is to prevent humidity absorption and oxidization that can damage the board. The technical effect is an improved quality of the mounting board during production.
Problems solved by technology
In the MSD that is deteriorated by moisture absorption, there is a concern that material defects are generated on the mounting board in a production process of the mounting board.
Meanwhile, even on the board on which the electronic component is mounted, deterioration may be generated which influences mounting quality such as warping of the board itself due to moisture absorption, peeling of a circuit pattern on the board, and rust on an electrode surface which is bonded to a terminal of the electronic component.
Method used
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[0023]Prior to description of the embodiment of the disclosure, problems in the related art will be simply described.
[0024]In the related art which includes PTL 1, there is a problem in that moisture absorption or oxidization with respect to a board with high humidity sensitivity, or influence of both is not considered in a production process of a mounting board, and production efficiency is reduced without failure being found up to a completion test.
[0025]Therefore, the present disclosure has an object of providing an electronic component mounting system and an electronic component mounting method which are able to manage quality of a mounting board in a production process of the mounting board which mounts an electronic component on the board on which management is necessary with respect to moisture absorption and oxidization.
[0026]Next, an embodiment of the present disclosure will be described below with reference to the drawings. First, with reference to FIG. 1, a configuration ...
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Abstract
An electronic component system includes an electronic component mounting line mounting an electronic component on a board (exposure managing board) for which management of exposure time is necessary, a package ID reader (recognition unit) which recognizes a package code (identification information) that is applied to a package bag, and a storage unit which stores an exposure time limit which is permissible from an open time before reaching a management release in which management of the exposure time is unnecessary. In the electronic component mounting system, the package code is read while the package bag is open, the read time is stored as the open time, an expected duration is calculated which is necessary from a predetermined point of time before reaching the management release, and it is determined whether or not the exposure time limit is exceeded before the board which is exposed in the atmosphere reaches the management release.
Description
BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to an electronic component mounting system and an electronic component mounting method for mounting an electronic component on a board.[0003]2. Description of the Related Art[0004]The electronic component mounting system produces a mounting board by mounting an electronic component such as a package component that is sealed by a resin in advance on a printed board, a flexible board, or the like. In a package component, there is a device with high moisture sensitivity (moisture sensitive device, hereinafter abbreviated to MSD) in which humidity greatly influences mounting quality after reflow. In the MSD that is deteriorated by moisture absorption, there is a concern that material defects are generated on the mounting board in a production process of the mounting board. Therefore, a system is suggested for appropriately managing use of the MSD that is exposed to the atmosphere for mounting from a state of being ke...
Claims
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IPC IPC(8): H05K13/04
CPCH05K13/04H05K13/08H05K13/021H05K13/084H05K13/086Y10T29/53174
Inventor KURATA, HIROAKI
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD