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Bonded structures

a technology of bonded structures and adhesives, applied in the field of bonded structures, can solve the problems of adhesives, such as solder, creating their own long-term reliability problems, and causing damage to integrated devices

Active Publication Date: 2018-06-21
INVENSAS BONDING TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach provides a robust, gas-tight seal that reduces the entry of harmful gases into semiconductor devices, enhancing their reliability and longevity by using direct metal-to-metal bonding techniques with embedded conductive and non-conductive features.

Problems solved by technology

Moisture or some gases, such as hydrogen or oxygen gas, can damage sensitive integrated devices.
Other adhesives, such as solder, create their own long term reliability issues.

Method used

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  • Bonded structures
  • Bonded structures
  • Bonded structures

Examples

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Embodiment Construction

[0021]Various embodiments disclosed herein relate to interface structures that connect two elements (which may comprise semiconductor elements) in a manner that effectively seals integrated devices of the semiconductor elements from the outside environs. For example, in some embodiments, a bonded structure can comprise a plurality of semiconductor elements bonded to one another along an interface structure. An integrated device can be coupled to or formed with a semiconductor element. For example, in some embodiments, the bonded structure can comprise a microelectromechanical systems (MEMS) device in which a cap (a first semiconductor element) is bonded to a carrier (a second semiconductor element). A MEMS element (the integrated device) can be disposed in a cavity defined at least in part by the cap and the carrier.

[0022]In some arrangements, the interface structure can comprise one or more conductive interface features disposed about the integrated device, and one or more non-cond...

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Abstract

A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.

Description

BACKGROUNDField[0001]The field generally relates to bonded structures, and in particular, to bonded structures that provide improved sealing between two elements (e.g., two semiconductor elements).Description of the Related Art[0002]In semiconductor device fabrication and packaging, some integrated devices are sealed from the outside environs in order to, e.g., reduce contamination or prevent damage to the integrated device. For example, some microelectromechanical systems (MEMS) devices include a cavity defined by a cap attached to a substrate with an adhesive such as solder. However, some adhesives may be permeable to gases, such that the gases can, over time, pass through the adhesive and into the cavity. Moisture or some gases, such as hydrogen or oxygen gas, can damage sensitive integrated devices. Other adhesives, such as solder, create their own long term reliability issues. Accordingly, there remains a continued need for improved seals for integrated devices.BRIEF DESCRIPTIO...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/00H01L23/498H01L23/528H01L23/532
CPCH01L24/29H01L23/49838H01L2224/29019H01L23/53242H01L23/53228H01L23/528H01L2224/8001H01L2224/80047H01L2224/08237H01L23/10H01L23/562H01L24/05H01L24/06H01L24/08H01L24/80H05K1/111H01L2224/05551H01L2224/05552H01L2224/05555H01L2224/05571H01L2224/05647H01L2224/05686H01L2224/06135H01L2224/06155H01L2224/06165H01L2224/06505H01L2224/80895H01L2224/80896H01L2224/08121H01L2224/80948B81C2203/035B81C1/00269B81C1/00293B81B2207/012H01L2224/80357H01L2224/06051B81C2203/019H01L2924/00012H01L2924/00014H01L2924/053B81B7/0032B81B2207/09
Inventor WANG, LIANGKATKAR, RAJESHDELACRUZ, JAVIER A.SITARAM, ARKALGUD R.
Owner INVENSAS BONDING TECH INC