Method and apparatus of symmetrically chamfering substrate
a chamfering table and substrate technology, applied in metal-working apparatus, grinding feed control, manufacturing tools, etc., can solve the problems of mass damage to productivity, increased cost due to the replacement of components, etc., and achieve the effect of excluding labor and time loss, determining the degree of chamfering table deterioration, and avoiding sacrificing productivity
Inactive Publication Date: 2018-10-25
SAMSUNG CORNING PRECISION MATERIALS CO LTD
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Benefits of technology
The invention allows for automatic and constant alignment of the chamfering wheel with the center point of the substrate edge, resulting in a symmetrically chamfered cross-section. This is achieved without the need for hardware-based compensation of the chamfering table, which can deteriorate over time. The invention also allows for quick determination of chamfering table deterioration and direct necessary measures. Additionally, the invention allows for continuous chamfering without stopping the operation, improving efficiency and minimizing labor and time loss. The invention also achieves improved symmetry and reduces differences in chamfered width between the upper and lower surfaces of the substrate.
Problems solved by technology
However, this operation requires a process of stopping the chamfering of the substrate and disassembling, reassembling and precisely compensating the table, thereby causing massive damage to productivity.
This also has the problem of the increased cost due to the replacement of the component.
Method used
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[0025]Reference will now be made in detail to various embodiments of the present invention, examples of which are illustrated in the accompanying drawings and described below, so that a person having ordinary skill in the art to which the present invention relates can easily put the present invention into practice.
[0026]Throughout this document, reference should be made to the drawings, in which the same reference numerals and signs are used throughout the different drawings to designate the same or similar components. In the following description of the present invention, detailed descriptions of known functions and components incorporated herein will be omitted when they may make the subject matter of the present invention unclear.
[0027]FIG. 3 is a flow diagram depicting a method of symmetrically chamfering a substrate according to an embodiment of the invention, FIG. 4 is a schematic view showing a plurality of measuring points on the edges of a substrate, and FIG. 5 is a side cr...
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A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.
Description
CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a continuation of U.S. patent application Ser. No. 14 / 287,799 filed on May 27, 2014 which claims priority from Korean Patent Application No. 10-2013-0060306 filed on May 28, 2013, the entire contents of each are incorporated herein for all purposes by this reference.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a method and apparatus of symmetrically chamfering a substrate, and more particularly, to a method and apparatus of symmetrically chamfering a substrate by measuring an asymmetric chamfering deviation of the substrate and controlling the position of a chamfering wheel based on the asymmetric chamfering deviation.Description of Related Art[0003]In a plurality of fields, the edges of substrates are required to be chamfered. For instance, glass substrates which are used for flat panel displays, such as a liquid crystal display (LCD), a plasma display panel (PDP) and an elect...
Claims
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IPC IPC(8): B24B9/08B24B49/12
CPCB24B49/12B24B9/08B24B49/02B24B9/10
Inventor HAN, MYEONGBO
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD